Pb- and Cd-free Mid Phosphorous EN | Nichem 1122 | Nichem 1122 is a mid phosphorus electroless nickel plating process especially developed for the deposition of bright nickel-phosphorus alloys by autocatalytic reduction. The ammonia-free Nichem 1122 system is a user-friendly liquid process consisting of four components.
Additional advantages: - High deposition rates throughout the lifetime of the plating solution
- Bright deposits for the entire lifetime
- Long bath life in excess of six replenishment cycles
- Provides excellent adhesion on various substrates
- Insensitive to metal contamination
- Can be used for both rack and barrel plating
- Operates in the same way as conventional electroless nickel systems
- Stable process capable of operation in both stainless steel and polypropylene tanks and equipment
- Production proven
- Provides good wear resistance and corrosion protection properties
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Nichem 1123 | The Nichem 1123 system is a user-friendly process consisting of three components with advantages similar to Nichem 1122. | 10647411 |
Nichem 1127 | Nichem 1127 is a mid phosphorous electroless nickel plating process especially developed for the deposition of bright nickel-phosphorus alloy on aluminum and ferrous based substrates by means of autocatalytic reduction.The Nichem 1127 system is a user-friendly liquid process consisting of three components.
Additional advantages: - High deposition rates throughout the lifetime of the plating solution
- Bright deposits for the entire lifetime
- Long bath life in excess of six replenishment cycles
- Tolerant to metallic impurities
- Insensitive to metal contamination
- Can be used for both rack and barrel plating
- Operates in the same way as conventional electroless nickel systems
- Stable process capable of operation in both stainless steel and polypropylene tanks and equipment
- Production proven
- Provides good wear resistance and corrosion protection properties
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Pb- and Cd-free High Phosphorous EN | Nichem 1152 | Nichem 1152 is an advanced high phosphorus electroless nickel plating process. It is a multi-component user-friendly liquid system and can be operated with ammonia or as an ammonia-free system.
Additional advantages: - Deposition rates up to 15 µm per hour without sacrificing bath stability. Optimum rates 8 - 13 µm per hour
- Deposits pass the Nitric Acid Test
- Bath chemistry is tolerant to metal impurities
- Provides excellent adhesion on various substrates
- Can be used for both rack and barrel plating
- Operates in the same way as conventional electroless nickel systems
- Stable process capable of operation in both stainless steel and polypropylene tanks and equipment
- Production proven
Provides excellent corrosion protection properties - EDTA - free process
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Pb- and Cd-free Low Phosphorous EN | Nichem Black EN | Nichem Black EN is a low phosphorus electroless nickel plating process especially formulated to deposit a black finish when processed through the Nichem BlackEN BL solution. Nichem BlackEN is a user-friendly liquid process system.
Additional advantages: - High deposition rates throughout the lifetime of the plating solution
- Provides excellent adhesion on various substrates
- Insensitive to metal contamination
- Black surface with high light absorbance
- Superior wear resistance compared to other black surface treatments
- Long bath life in excess of four replenishment cycles
- Has excellent heat resistance and light resistance
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