Corporate News
15. May 2013
Tradefair Preview
More information regarding future Atotech show and tradefair participations.
13. May 2013
SUR/FIN 2013
From June 10 - 12, Atotech is presenting most innovative and environmentally sound products on this year’s SUR/FIN.
15. April 2013
JPCA Show 2013
From June 5 - 7, JPCA Show 2013 will be held at Tokyo Big Site in Tokyo, Japan.
15. January 2013
26. November 2012
Advanced Non-Etching Adhesion Promoter for Next Generation IC Packaging
The insatiable demand for greater computing power and the mission to fulfill Moore's Law continue to drive technological advancement.
19. November 2012
HKPCA Show 2012
From November 28 - 30, HKPCA 2012 will be held at Shenzhen Convention & Exhibition Center in Shenzhen, China.
12. November 2012
CupraEtch™ DE – The new and "green" differential etch process for SAP manufacturing
One of the key manufacturing processes for enabling the construction of IC-substrates with semi-additive processes (SAP) and modified semi-additive processes (MSAP) is the so-called differential etch process. It leads to...
Electronics News
07. March 2013
System on Package Research – Atotech Collaborates with Georgia Tech Packaging Research Center
Atotech has expanded its collaboration with the 3D Systems Packaging Research Center (PRC), housed in the Manufacturing Research Center building on the Georgia Tech campus. The PRC is the leading industry-centric packaging...
26. February 2013
Atotech's new low-cost super concentrate: BondFilm™ MS 500 joins the BondFilm™ Family
Since the first BondFilm™ product launched in 1998, this product family has been a key contributor to success for Atotech. To continue to stand out from the masses, Atotech’s Surface Treatment Technology team recently launched a...
11. February 2013
Reducing costs and Pd consumption: Atotech's Economic Activator Neoganth 800
A major challenge for the PCB industry is to overcome the dependency on palladium spot prices by reducing the palladium content in the manufacturing process.Atotech's business technology team for Plating Through Holes (PTH)...
10. October 2012
05. October 2012
Filling Through Holes and Blind Micro Vias with Copper
Using Reverse Pulse Plating and Insoluble Anodes
General Metal Finishing News
20. March 2013
13. January 2011
Hard Chrome Process for Rotogravure
GravurChrome® is a robust process specifically designed to meet the needs of rotogravure hard Chromium platers.
12. January 2011
Fumetrol® 21 Family - New Non-PFOS Mist Suppressants
The use of a surfactant as a mist / fume suppressor for chrome plating is one of the options for ensuring protection for operators of the process. These mist suppressants must be practically inert in the harsh plating environment...
Electronics Materials News
07. October 2009
New Plugging Paste PP 2793 for high Tg substrates
In addition to the Plugging Paste PP 2795, which is used for standard FR 4 substrates we are now offering the new PP 2793, which is designed for the use in high Tg substrates.
Semiconductor News
29. October 2012
