12. November 2012
CupraEtch™ DE – The new and "green" differential etch process for SAP manufacturing
One of the key manufacturing processes for enabling the construction of IC-substrates with semi-additive processes (SAP) and modified semi-additive processes (MSAP) is the so-called differential etch process. It leads to...
07. March 2013
System on Package Research – Atotech Collaborates with Georgia Tech Packaging Research Center
Atotech has expanded its collaboration with the 3D Systems Packaging Research Center (PRC), housed in the Manufacturing Research Center building on the Georgia Tech campus. The PRC is the leading industry-centric packaging...
26. February 2013
Atotech's new low-cost super concentrate: BondFilm™ MS 500 joins the BondFilm™ Family
Since the first BondFilm™ product launched in 1998, this product family has been a key contributor to success for Atotech. To continue to stand out from the masses, Atotech’s Surface Treatment Technology team recently launched a...
11. February 2013
Reducing costs and Pd consumption: Atotech's Economic Activator Neoganth 800
A major challenge for the PCB industry is to overcome the dependency on palladium spot prices by reducing the palladium content in the manufacturing process.Atotech's business technology team for Plating Through Holes (PTH)...
General Metal Finishing News
12. January 2011
Fumetrol® 21 Family - New Non-PFOS Mist Suppressants
The use of a surfactant as a mist / fume suppressor for chrome plating is one of the options for ensuring protection for operators of the process. These mist suppressants must be practically inert in the harsh plating environment...