 |
VIALAM MV 4000 Series - RRCC
Vialam MV 4000 is a high Tg halogen free, glass reinforced resin coated copper foil. The product can be used to replace the standard copper and prepreg construction for IC Substrate. Applications include desktops, notebooks, handheld devices etc. As in MV 2000, it has the advantage that the copper and prepreg are built as one entity thus simplifying the laying up process at customer's end. MV 4000 has also been proven with good decomposition temperature results and is therefore thermally a very stable product to use.
General Features and Benefits
- High Tg resin system
- Ultrathin glass styles
- Low water absorption
- High peel strength
Typical material properties of MV 4000* (for details please contact our local or global sales staff)
(* using 1015 glass fabric, 70% RC)
| MV 4000 | IPC TM-650 | |
|---|---|---|
| Thermal Properties | ||
| Tg (DSC) | 183°C | 2.4.25 |
| Tg (DMA) | 187°C | 2.4.24.5 |
| Decomposition Temperature (5% wt. loss) | 400°C | 2.3.40 |
| CTE < Tg | TBD | 2.4.24.C |
| CTE > Tg | TBD | 2.4.24.C |
| CTE (X/Y, 40 - 270°C) (X-fill, Y-warp) | 22/24 ppm / °C | 2.4.24.5 |
| Time to delamination T300 | > 30 min | 2.4.24.1 |
| HPCT | Pass (Pass/Fail) | 2.6.16 |
| Mechanical | ||
| Young's Modulus | 3.56 GPa | 2.4.18.3 |
| Tensile Strength | 191.00 MPa | 2.4.18.3 |
| Elongation | 6.76% | 2.4.18.3 |
| Peel Strength (12 μm Cu) | 0.91 N/mm | 2.4.9 |
| Peel Strength after solder dip at 288°C (12 μm Cu) | TBD | |
| Chemical | ||
| UL Burning Test | TBD | UL 94 |
| Water Uptake | 0.93% | 2.6.2.1 |
| Electrical | ||
| Dk (1GHz) | 4.3 | 2.5.5.9 |
| Tan δ | 0.0239 | 2.5.5.9 |
| Volume Resistivity | 2.20E+15 Mohmcm | 2.5.17.1A |
| Surface Resistivity | 1.40E+14 Mohm | 2.5.17.1A |
| Electric Strength | 164.3 KV/mm | IEC60243-1 (98) |
Material Availability
MV 4000 is available in different copper thicknesses, namely, 12 µm, 18 µm, 3/35 µm, 5/35 µm. Copper foils used are according to the IPC 4562 Grade 3 standard. The ultrathin copper foils are also equipped with VLP (very low profile) and HTE (high temperature elongation) properties.
Standard Cu thickness:
| Thickness | Weight | IPC Code |
|---|---|---|
| 12 μm | 1/3 oz | T |
| 18 μm | 1/2 oz | H |
Special Cu Thickness (upon special requests from customers):
| Thickness | IPC Code |
|---|---|
| 2/35 μm | |
| 3/35 μm | |
| 5/35 μm | E/1 |
MV 4000 comes with a dielectric thickness range of 30 to 50 µm at increments of 10 µm. Other copper foil or dielectric thicknesses can also be made available upon customer's request.
| Copper Foil: Grade 3, VLP | 3/35, 5/35, 12, 18 μm |
| Glass Type: 1015/1027/1037 | 30 to 50 μm |
Storage Conditions
| Condition 1 | Condition 2 | |
|---|---|---|
| Temperature | < 23ºC | < 6ºC* |
| Humidity | < 50% | |
| Shelf Life | 180 days from delivery | > 180 days from delivery |
* Note : Material should be stored in unopened bags for 24 hours at ambient temperature before use.