- TFT: Schematic set-up
TFT is build-up by a sequence of steps including photolithographic processes and vapor deposition techniques like sputtering and PECVD
- Uniplate LB e'less Cu production line build to handle glass substrates in horizontal mode
Flat Panel Displays: Metallization of Displays / Glass Substrates
Recent developments in Flat Panel Display Technology require improved performance of the electronic driver circuits.
Unlike cost intense and high temperature operated systems, such as sputtering and PVD, wet chemical based processes run at moderate conditions and are cost effective.
Atotech responds to the increasing interest from flat panel makers for wet chemistry based processes with a variety of development activities.
Atotech is currently developing wet chemical metallization processes to enable FPD manufacturers to cope with this challenge. Environmentally friendly formaldehydefree electroless Cu is targeted to provide improved conductivity as well as increased resistance to electro migration for metallic TFT lines. In addition, introducing well established wet chemical processes has a cost saving potential over state-of-the-art technologies like sputtering and vapor deposition.
Overview on Fields of Applications (Systems tested with wet chemistry):
