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Direct Plating
Direct plating can be a viable "greener" alternative to electroless copper for selected application areas. Atotech offers Seleo CP Plus and Seleo CP E, conductive polymer processes, and Neopact, a palladium based process. Both process types can be applied for vertical as well as for horizontal production.
Our state of the art horizontal conveyorized Uniplate P / CP and Uniplate P / NP equipment is specially adapted to the Seleo CP Plus/CP E respectively Neopact process to achieve best results while highly mitigating the environmental impact.
Seleo CP Plus and Seleo CP E
Seleo CP Plus is a very short process, which results in many environmental benefits. Being BMV capable, it is suitable for both HDI and MLB production. Seleo CP E is a cost effective process for MLB (non-blind microvia) production only.
Environmental Benefits
- Formaldehyde free
- Cyanide free
- Very low concentration of complexing agent
- Short process with all concomitant environmental effects
- Less process chemistry necessary
- Reduced wastewater generation
Neopact
Neopact has an unparalleled ability to adhere to almost any type of base material. This makes it the ideal choice for HDI, MLB and Flex applications with "exotic" laminates.
Features and Benefits
- Formaldehyde free
- Cyanide free
- Good adhesion on wide variety of materials
- Applicable as vertical and horizontal process
- BMV capable