Electroless Nickel / Immersion Gold (ENIG)
Atotech has a long history with ENIG employed in mass production. Driven by the needs and demands of PCB industry and OEMs, Atotech developed several ENIG processes, which are already established in the market. Solutions are provided for instance to fine line plating and dry film application. Processing of flexible PCBs is possible as well. Atotech's ENIG processes provide maximum thickness uniformity and perfect planarity for aluminium wire bonding and when Ni/Pd/Au plated for gold wire bonding. In case a PCB manufacturer has to stop and resume production frequently, the dummy-plating-free AuNic process will help to save time and money.
The ENIG processes developed by Atotech featuring:
- Lead free soldering
- Immersion gold corrosion sensitive applications
- Dummy plating free electroless nickel
- Flexible PCBs
- Fine line plating
- Dry film application
- Protection in harsh environments
- High volume production
- Bonding: Aluminium wire / Gold wire (Plating nickel / palladium / gold)
The processes deposit uniform ENIG coatings over exposed copper surfaces as well as in plated through holes and blind micro vias (BMV), even in those with high aspect ratios. The ENIG coated through holes and BMVs have greater mechanical stability provided by the deposited electroless nickel layer.Compared to HASL and its alternatives, excessive copper intermetallic compound (IMC) formation during multiple soldering operations is not an issue. The protective gold layer over nickel withstands easily several lead-free soldering cycles. Higher peak temperatures during lead free soldering do not lead to discoloration or oxide formation on the surface.
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