- Patented ConStannic Regeneration Unit
- Crystallizer for Cu reduction
Regeneration of Immersion Tin Chemistry: ConStannic & Crystallizer
The patented ConStannic regeneration unit & Crystallizer offers our industry the highest efficiency with regard to chemical consumption. Immersion tin processes dissolve copper and rapidly build-up Sn4+. Heavy sludge is formed. The build-up of copper and Sn4+ is conventionally counteracted by extensive bleed & feed dosing or very high new make up frequencies. With Atotech's ConStannic Technology, Sn4+ is electrolytically reduced to the useful Sn2+ and the Crystallizer units precipitate copper. The ConStannic and Crystallizer significantly reduce the chemistry waste.
ConStannic
The major task is to keep the tin(IV) concentration as constant and low as possible.
Features and Benefits:
- Recycles Sn2+ by transforming Sn4
- Avoids re-dissolution of the freshly deposited tin layer
- Prevents uncontrolled precipitation, which causes blocking of equipment and reducing rinsability of PCBs
- ConnStanic is only used for horizontal mode (stronger turbulence - higher air intake)
- Less down time due to less maintenance
- Less sludge formation
Crystallizer
A system removes the copper in the tin solution. It runs in continuous mode to maintain the overall bath composition as balanced as possible. Applicable in vertical and horizontal mode.
Features and Benefits:
- Immersion tin solution is cooled down
- Precipitation of copper compound takes place at a low temperature
- Continuous removal ensures constant low copper concentration
- Constant plating characteristics
- Less down time due to less maintenance
- Less chemistry consumption
- Less sludge formation
