IPC APEX EXPO 2012

From February 28 - March 01, IPC APEX EXPO 2012 will be held in San Diego, USA.

The show focuses on printed circuit boards, electronics manufacturing and test technology.
Please feel invited to find out more about our new ideas and developments for PCB Manufacturing.

 Our highlights at the show:

• Green Manufacturing of Chemical Products with Auxiliary Systems
• Printoganth P Plus - Best Horizontal Electroless Copper for High End PCBs
• Printoganth PV E - Vertical Electroless Copper for Demanding Substrates
• Cupracid TP/TP1 - The New Benchmark for DC Technology
• Cuprapulse XP7 - Reverse Pulse Plating for Highest Productivity in HDI
• BondFilm Family - Oxide Replacement Processes for Advanced Applications
• BondFilm XP - Oxide Replacement Process with Enhanced Adhesion PerformanceAurotech Flex - Flexible ENIG with Improved Bending Performance
• Universal Finish SolderBond (ENEPIG and ENEP) - For Soldering, Au-Wire and Cu-Wire Bonding
• Aurotech Flex - Flexible ENIG with Improved Bending Performance
• Xenolyte - Pad Metallization Reliability
• As well as complete process solutions for
  - Multilayer Board Production
  - HDI (High Density Interconnects) in Mobile Phones
  - Immersion Tin
  - Advanced Packaging Technology

We are looking forward to see you at the IPC APEX EXPO and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for 2012 and 2013.

For more information regarding the show, visit: www.ipcapexexpo.org