HKPCA Show 2011

From November 30 - December 02 HKPCA 2011 will be held in Shenzhen, China.

HKPCA offers you the complete value chain for electronics manufacturing throughout the three days of the exhibition. You will find everything from manufacturing of PCBs, components and cables towards module production and assembly, test and measurement devices as well as production equipment.

 Our highlights at the show:

• Printoganth P Plus – Best Horizontal Electroless Copper for High End PCBs
• Seleo CP Plus – Best Conductive Polymer Direct Metallization
• InPulse 2HF – The Low Cost Solution for Blind Micro Via Filling
• InPro A300 – BMV Filling in Vertical Conveyorised Equipment
• Secure HFz – Non-Etching Adhesion Promoter for High Frequency and Packaging Applications
• BondFilm LDD – Laser Direct Drilling Technique for Reliable Via Formation
• Stannatech – The Leading Immersion Tin Process Designed to Meet Future Requirements
• Aurotech Plus – Next Generation Mid-P ENIG Process
• HERMES – High Density Integration by Embedding Chips for Reduced Size Modules and Electronics Systems
• Additive RFID Antennas
• APR DI – Liquid Photoimageable Etch Resist for Laser Direct Imaging 48
• Specialty Substrate Products
• New Systems Technologies
  - TTS - Touchless Transport System for Uniplate
• Complete Process Solutions for
  - Flex / Rigid-Flex PCBs
  - Multilayer and HDI Board Manufacturing
• Green Technology – Latest Process and Equipment Developments

We are looking forward to see you at the HKPCA show and would be pleased to discuss with you our latest technologies, the opportunities but also the challenges we see for the next years.

For more information regarding the show, visit: hkpca-ipc-show.org/2011/en/home.html