Electrolytic Nickel, Palladium and Gold Plating with Nikotron / Pallatron / Aurotron
Nikotron electrolytic nickel electrolytes are available based on sulphamate or on sulfate electrolyte depending on the particular application and requirements.
Pallatron electrolytic Palladium acts as a Diffusion Barrier against Nickel diffusion and enables Reduction in Gold thickness.
Aurotron H electrolytes for deposition of hard gold alloyed with cobalt or nickel for optimum wear resistance especially for connector applications.
Aurotron B for the deposition of pure gold for wire bonding and soldering particularly for IC Substrates.
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