Conformal Plating

Standard Conformal Plating

Conformal Plating under pulse conditions with insoluble anodes at current densities up to 12 A/dm² gives state of the art throwing power results in through holes and also blind micro vias (BMV). Lower overall copper thickness is required, due to excellent throwing power and copper distribution on the surface, resulting in higher productivity.
Atotech's Conformal Plating Processes are specifically developed for the InPulse 2. They are ideally suited for HDI production with a combination of plated blind micro vias and through holes on the same substrate. The additives show excellent stability, no harmful breakdown products are produced even during pulse plating.

Benefits to Conformal Horizontal Copper Plating

• Optimal result through best surface distribution
• High productivity system using pulse plating up to 12 A/dm²
• Void free plating of BMVs due to optimal pre-treatment
• Frequency control of fluid delivery to give best possible wetting of BMVs and through holes
• Fine-grain, matt to semi-matt copper deposits with a salmon pink colour are plated. The deposits are low stressed and exhibit excellent ductility and tensile strength