Horizontal Superfilling

On substrates with only blind micro vias the Superfilling process may be used. With this innovative process the InPulse 2 system can achieve filling results requiring half the plated copper thickness in comparison to conventional filling processes. The plated deposit meets all reliability standards for filled blind micro vias. 

Features and Benefits

• Unsurpassed surface distribution due to panel plating
• Lowest surface plating due to superior filling capabilities
• Very fine line capability down to 2 MIL
• Simultaneous filling of various diameter
• Yield improvements with integrated wet to wet production
• Cost savings in raw materials and production: Copper, Solder mask, Waste water treatment and Etching