- FIB section of the deposit from Sulfotech electrolyte:
- Sulfotech LST: Uniform tin metal resist plated in blind micro via at current density 2 A/dm²
Vertical Tin Plating
Sulfotech
Sulfotech offers best throwing power in DC plating but with least resist sensitivity. This is important with thicker boards, smaller holes and the necessity for plating of blind micro vias. The electrolytes can also be used with Eductor agitation enhancement
Sulfotech electrolytes can be used based on sulphuric acid or methane sulphonic acid. The MSA version allows the use of titanium anode baskets which means more economical tin plating and environmentally efficient use of resources.
Sulfotech based on sulphuric acid electrolyte can also be used with zirconium anode baskets to gain similar advantages
Tinpulse
Tinpulse is the innovative process for tin plating which utilises the well known advantages of pulse plating for the application of metal resist deposition.
The Tinpulse electrolyte is based on methane sulphonic acid and gives significant advantages in metal distribution both on the surface of the panel, in through holes and blind micro vias. In comparison to DC tin plating generally much higher current densities may be used giving obvious productivity advantages.
Even at comparatively high current densities, Tinpulse plates reliable and etch resistant tin layers with unsurpassed throwing power and surface thickness distribution. This leads to savings in metal costs, and more reliable strip and etching results.