Cupracid TP: High Productivity at high current density (1.5 - 3.5 A/dm-2)
Cupracid CV2 high productivity at 2.5 A/dm² with panel 1.6 mm and hole diameter 0.25 mm
Throwing power over 80%

Vertical DC Plating with Soluble Anodes

Cupracid electrolytes are available for use in conventional or vertical conveyorised equipment using air or force flood sparger agitation for high volume production at high current densities as well as for the production of high layer count material at low to medium current densities and also for the highest aspect ratio plating.

With our electrolytes we continue to prove our ability to meet widely differing customer requirements in terms of quality, production reliability and manufacturing costs.

Our goal is to continue to satisfy these requirements in the future.

 

Cupracid TP

The Cupracid TP process gives significantly improved throwing power at all current densities but in particular at high applied current densities from 1.4 A/dm²  to 3.5 A/dm².
The higher current density and therefore the reduced plating time gives a large productivity increase for all aspect ratio panels. The improved throwing power and surface distribution also leads to big savings in copper anodes and in solder mask, these materials have seen significant price increases over the last 12 month so Cupracid TP has become important in enabling cost savings. The electrolyte has a low surface tension which makes it very suitable for the plating of high aspect ratio panels and also blind micro vias. This low surface tension helps to prevent surface defects caused by air bubbles adhering to pattern plate surfaces.

Cupracid TP can be used for panel or pattern plating applications and also in back panel production where a modified electrolyte is used for example in production of panels 10 mm thick.

Cupracid TP sets new standards for throwing power using a medium to high current density range for high productivity.

  • Current density application between 1.4 A/dm² to 3.5 A/dm²
  • Excellent throwing power at high current densities
  • Suitable for standard hoist type equipment in panel or pattern plate mode
  • Low surface tension electrolyte to ensure wetting of blind micro vias and high aspect ratio through holes


High Quality and Reliability: Excellent copper crystal structure at wide current density range

Cupracid TP1

The Cupracid TP1 process is a development of Cupracid TP particularly intended for applications where low current densities are required for production of high aspect ratio panels or for pattern plate applications with isolated track layout preventing the use of higher current densities.

Cupracid TP1 combines the advantages of Cupracid TP to give a process with a larger working window in the low current density area.

Cupracid TP1 has been developed with the target of low to medium current density plating of high layer count panels.

  • Suitable for use with low copper concentration for highest throwing power results.

 

Cupracid CV2

The process development was based on Atotech's extensive experience with high current density conveyorized plating systems.

  • Specially designed for use in vertical conveyorized equipment at high current densities with soluble copper anodes
  • Cupracid CV2 has excellent throwing power for high productivity
  • Compatible with conveyorized equipment using force flood agitation
  • The electrolyte has a low surface tension electrolyte to ensure wetting of fine structures
  • Plated copper deposits are ductile and fully bright bright