Vertical Pulse Plating with Cuprapulse

Reliable Pulse Plating For Improved Copper Deposit Distribution

Pulse plating gives an "electrical tool" which is used to give a further optimization of the plating system. With periodic short anodic pulses applied to the cathode the direction of the current flow is altered. During the anodic pulses the current density is for example 2.5 - 3 times higher than during copper deposition. This results in a polarization / inhibition effect dependant on the local current density which results in significantly improved copper thickness uniformity giving improvements in throwing power particularly for high aspect ratio plating.

Cuprapulse XP7

The latest development in pulse plating electrolyte from Atotech has the following advantages:

• Copper deposit with excellent physical properties
• Very stable electrolyte in operation with no harmful breakdown products
• Wide additive operating window
• Can be used with strong reverse pulse parameters for best throwing power
• Good throwing power and levelling depending on pulse parameters used
• Plated deposit is fine grain matt to semi bright depending on pulse parameters