Advanced Surface Preparation

As the technology demand increases, the thermo mechanical stresses applied to photo resists and solder masks increases, finer line and spaces means increased risk of damage during processing, and Pb free reflow temperatures and finer solder dams risk increased failure in service. Atotech offer a range of products maximize the adhesion of resists, and other products to modify the surface characteristics to maximize production capacity while also offering improvements in technical capability

CupraEtch

For high-density circuit imaging, Atotech has introduced CupraEtch. The highly defined and uniform copper surfaces achieved with CupraEtch provide consistently improved adhesion of the photo resists and solder masks. The result is unsurpassed sidewall definition during developing for defect-free etching and plating. CupraEtch is offered as a total system with process equipment, chemistry and controls specifically developed for this application.

CupraEtch DT

The CupraEtch DT process offers excellent surface roughness with a wide process window that allows for total process control. Unlike other systems, CupraEtch DT has a high tolerance to chloride, which is known to suppress etching reactions and lead to unstable processes. With a wide tolerance to this contaminant, CupraEtch DT provides a fast and stable etching process that creates a unique surface profile ideal for dry and liquid film pretreatment.

CupraEtch SR

CupraEtch SR is the latest addition to the CupraEtch series and is suitable for use with dry film / solder masks processing. This stable process creates a high level of roughness that is ideal for solder masks that will be exposed to aggressive surface finishes such as immersion tin. CupraEtch SR can be fully analysed for optimum process control and has a high copper loading capacity in order to minimize waste treatment.

Secure HFz

In addition to enhancement for dielectric bonding, Secure HFz also offers excellent adhesion for soldermask materials. The same non etching process used for IC Substrate manufacture gives the same adhesion promotion mechanism on solder masks, further guaranteeing that the final line has exactly the same geometry as it did when it was first formed.

BondFilm LDD

With the advent of Laser Direct Drilling, the market proven BondFilm series has been extended in order to maximize CO2 laser absorption and ensure improved direct laser drilling. In addition to improved laser absorption, the BondFilm LDD process gives consistent hole size, reduced "Copper Splash" and with less undercut. The organo metallic layer has been re-optimised to ensure no loss of mechanical or chemical properties, thus allowing BondFilm LDD a dual use in laser drilling and multilayer assembly, meaning a single production line for two production processes.

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