CupraEtch SR

Atotech's CupraEtch SR is a unique process for improving the adhesion of photoresists and soldermasks for the production of printed circuit boards. CupraEtch SR solution is designed to form uniformly micro-roughened copper surfaces, providing the ideal topography for adhesion enhancement of photoresist and liquid photoimagable soldermask.

: CupraEtch SR provides excellent adhesion with fine soldermask features

CupraEtch SR has been developed for horizontal conveyorized spray application.

Features and Benefits

Significantly improved copper adhesion to dry film and soldermask
Excellent surface characteristics with uniform roughness
High copper holding capacity up to 40 g/L
Minimal copper removal
Compatible with a wide range of selective finishes, including ENIG and immersion tin