CupraEtch

Today's new technologies create new demanding challenges for photoresist adhesion. With microvias and ultra-fine lines, conventional treatment methods are no longer dependable. CupraEtch was developed to meet the most demanding adhesion requirements for photoresists in response to these new technologies.

With CupraEtch, it is no longer necessary to remove 2 to 3 microns of copper or use adhesion promoters that are difficult to remove and interfere with subsequent processes. CupraEtch optimizes adhesion with no such problems.

: CupraEtch AFM

Optimized Surface Topography for Superior Adhesion

CupraEtch is a simple, low-temperature two/three stage process that is compatible with most conveyorized systems. CupraEtch performs within a wide working window, providing similar surface topographies and adhesion results throughout a wide range of operating copper concentrations. By chemical design, CupraEtch preferentially attacks the copper structure at the grain boundaries. In this way it achieves the desired combination of uniform "first and second order roughness" with an optimal etch of 1-1.5 µm This combination is the path to optimizing roughness and surface area, the key to CupraEtch.With optimized surface topography and resultant adhesion, CupraEtch enables unsurpassed sidewall definition during developing, creating the necessary conditions for defect-free etching and plating.

Features and Benefits

Optimized surface topography and adhesion
Superior range of adhesion force
Simple, low-temperature two/three stage process
Compatible with most conveyorized systems
Wide working window
Unsurpassed sidewall definition
Improved product quality and yields
Reduced operating costs