Atotech's Secure HFz process has been developed specifically to improve the bond adhesion between inner layer or outer layer patterns and dielectric materials, especially those used within the production of highly integrated chip carriers.
With the increasing complexity of chip carrier's, more attention is being focused on the use of non-etching adhesion promoters during bonding pretreatment. Due to its unique non-etching process, Secure HFz ensures that the final Copper structure retains its original dimensional and surface characteristics.
Secure HFz deposits a thin and highly uniform Tin layer on the Copper, which is subsequently coated with an adhesive Silane layer.
As this process contains no etching operations, any surface roughness arises from the underlying Copper layer only.
Secure HFz ensures enhanced bonding between Copper layers and the dielectric materials used in multilayer and chip carrier manufacture. This results in excellent peel strength while also providing resistance against chemical attack.