Recent Publications

The intention of publications made by Atotech is to share the results of our extensive research and development on a non commercial basis. With these presentations we aim to provide in-depth process information and inform about the latest investigations and results in each technology field. It should enable the reader to gain a complete and comprehensive understanding of our process solution and of general phenomena encountered in the electroplating industry.

This segment presents the recent papers from the business technology team surface treatment.

Use of Non Etching Adhesion Promoters in Advanced PCB Applications
R. Massey, A. Zee, Atotech Deutschland GmbH, October 2010

Based on tests carried out with commercially available chemistry, this paper discusses the advantages available through the use of NEAP processes for inner layer bonding and soldermask pretreatment. The process is characterized with a view to high volume manufacturing and its performance is reported through short and long term reliability testing. The work described shows that NEAP processes currently available on the market are viable alternatives over existing etch based adhesion technologies and offer increased adhesion to a wider range of materials, plus the added benefit of enhanced signal transmission in high frequency applications.

Download complete paper here: pdf file (File size 380 kB)

The Advent of Non-Etching Adhesion Promoters For Use Within the Printed Circuit Board Industry
R. Massey, Atotech Deutschland GmbH, April 2010

While the data represented here is achieved through computer simulation, it is clear that the adoption of the NEAP processing offers distinct advantages in the area of high frequency applications. There has been wide scale use of Low or even No Profile Copper Laminates in order to minimise signal loss, but these have then been used in combination with roughened tracks, such laminate materials if used in combination with NEAP chemistries offer unrivalled signal transmission characteristics that can not be achieved with traditional etch based adhesion promoters.

Download complete paper here: pdf file (File size 350 kB)

The Next generation of Multilayer Bonding of High-Performance Dielectric Materials in Compliance with lead-Free Initiatives
Patrick Brooks, Atotech Deutschland GmbH, June 2004

In this paper the synergy of an Intergranular Etch (IGE) or Oxide Alternative with the white oxide will be examined. The synergy of these two systems yields a process that has all the advantages of both systems: High peel strength, excellent thermal reliability, no pink ring or wedge voids, and ease of horizontal processing, but none of their weaknesses.

Download complete paper here: pdf file (File size 40 kB)

Secure™ HTg – The Next generation of Multilayer Bonding of High-Performance Dielectric Materials in Compliance with lead-Free Initiatives
Patrick Brooks, Atotech Deutschland GmbH, June 2004

Long-term continuing market growth within certain electronic sectors are fueling the need for new circuit board materials.

Download complete paper here: pdf file (File size 370 kB)

A Novel Approach for a Non-Etching Adhesion Promoter for the Next Generation of IC Substrates
Patrick Brooks, Atotech Deutschland GmbH, Shingo Kumashiro, Atotech Asia Pacific Ltd, Hong Kong, China, Koichiro Terauchi, Atotech Japan Ltd, Japan, June 2007

Targeted for meeting the requirements of advanced IC manufactures for a Non-Etching Adhesion Promoter (NEAP) in the manufacture of sub 10 / 10 µm line and space, the Secure™ HFz process represents an innovative approach to enhancing the bonding of Ajinomoto Build-up Film (ABF) materials and comparable films as well as solder masks while not significantly etching the copper conductor to promote adhesion but rather using Silane based chemical adhesion promoters.

Download complete paper here: pdf file (File size 200 kB)

A Novel Approach in HDI Microvia Manufacturing: Understanding Laser Direct Drilling
Patrick Brooks, Adrian Zee, Atotech Deutschland GmbH, Robin Taylor, Atotech United Kingdom Ltd, UK, March 2008

Microvia formation by laser is one of the key technologies for high-density printed circuit board production. Commercially available laser drill systems include two kinds of laser technology: CO₂ laser and UV laser. The CO₂ laser is much cheaper and faster than the UV laser but has the disadvantage of low energy adsorption for Cu surface. To overcome this, the industry has mainly been using the conformal mask technique, a complicated imaging and chemical etching process to make an opening in the copper surface to expose the epoxy prior to CO₂ laser drilling.

Download complete paper here: pdf file (File size 560 kB)

Permanent Non-Etching Adhesion Promotion System for Solder Mask Applications
S. Kumashiro, R. Massey, Atotech Asia Pacific Ltd, Hong Kong, China, T. Huelsmann, C. Sparing, Atotech Deutschland GmbH, October 2008

With the constant drive for miniaturization in the IC sub¬strate market, and the increasing performance demands being made on completed assemblies, the use of etch based adhesion promoter systems is coming into question. Unlike the current technology, Atotech's Secure™ HFz process enhances the adhesion between a Copper conductor and a solder mask with no etching to the conductor itself. This unique approach is designed to meet the current and future market requirements typical to ultra fine line IC substrate manufacturing (sub 10 / 10 µm line and spaces can be achieved).

Download complete paper here: pdf file (File size 240 kB)

Temporary None Etching Adhesion Promoter for Dry Film
J. Huang, R. Massey, Atotech Asia Pacific Ltd, Hong Kong, China, Dr. N. Lützow, C. Sparing, Dr. D. Tews, M. Thoms, Atotech Deutschland GmbH, October 2008

Within the Semi Additive Process (SAP) it is common for the Process's Copper seed layer to be only chemically cleaned before dry film lamination and imaging. While this has been historically acceptable, as imaging requirements increase, it is now beginning to reach its limitations. Two methods to resolve this exist; the one being pursued by dry film manufacturers is to increase the flow and adhesion properties of the dry films themselves, while the other solution is to treat the available copper surface so that its own adhesive properties increase. Atotech's ResistAssist® IC process is a novel non-etching chemistry that actively increases dry film adhesion without any effect on track geometry or subsequent processing steps.

Download complete paper here: pdf file (File size 160 kB)

Non-Etching Adhesion Promoter for IC Substrates
T. Hülsmann, A. Zee, Atotech Deutschland GmbH, S. Kumashiro, R. Massey, Atotech Asia Pacific Ltd, Hong Kong, China, September 2008

Driven by the need for a Non-Etching Adhesion Promoter in the manufacture of sub 10 µm features in IC substrates, the Secure™ HFz process represents an innovative approach to enhance the bonding of Ajinomoto and similar build up films, as well as solder masks while not significantly etching the copper conductor. This novel process makes use of a silane based chemical treatment to replace the more traditional etch based systems in order to improve surface adhesion characteristics.

Download complete paper here: pdf file (File size 420 kB)