All processes are available in different transport systems:
- UTS-XL for panel thickness' up to 6 mm
- UTS-s for panel thickness' between 50 µm and 2,4 mm
- UTS-xs for ultra flex material (down to 25 µm base material + 2 x 3 µm copper clad) and Reel to Reel for transport of web material
Universal Transport System (UTS-xs) - For Ultra Flex Material Processing
The UTS-xs will support all your horizontal desmearing, PTH and plating applications. Our System is the 1st equipment available in the industry today, for ultra flex material down to 25 μm + 2 x 3 μm copper clad. This offers the customer the ability to process different board thicknesses without production interruption, featuring automatic solution level management and directed solution flow.
Reel-to-Reel Uniplate Systems
Fully automated system to uncoil, transport, Plating Through Hole and electrolytic copper deposition at high current density in horizontal Uniplate Systems. The new System enables easy handling and processing of Reel-to-Reel flex material at high productivity rates.
W - Wide Uniplate Systems
Uniplate and Horizon Systems are now available for 32" wide panels for increased throughput capability (see graph). The Systems can be equipped with devices for thin material transport as available from Atotech today.
TTS® Touchless Transport System with Horizontal Processing for
IC Substrates and High-Tech HDI
In Atotech's TTS ® the panels are automatically positioned between two magnetic strips, tensioned and speed- adjusted loaded onto the touchless mode through the entire line and processes, eradicating the surface damage issues and assuring a uniform exposure to wet chemistry.