Functional Electronic Coatings – Surface Technologies for Electrical and Electronic Industries

Commitment to High-tech Solutions

Atotech’s Functional Electronic Coatings (FEC) business unit within the Atotech General Metal Finishing segment aims at providing connector and IC / leadframe industries with state-of-the-art systems and processes, superior manufacturing know-how and innovative green technologies.

FEC Program

IC / Leadframe Applications

Connector Applications

Pretreatment and Post-treatment

- Leadframe roughening for MSL
  improvement
- Outer lead plating with solderable pure
  tin for high-speed and rack
- Ultrathin nickel / palladium / gold for
  preplated leadframes
- High-speed silver spot, ring and
  dot plating

- High-speed and conventional gold alloy
  (nickel, iron, cobalt), palladium and
  palladium alloy and silver plating
- High speed nickel and copper plating
- Bondable pure gold plating
- Lead-free, solderable, high-speed and
  conventional tin plating
- Nickel gold plating for highest
  corrosion resistance
- 3D-MID technology

For All Connector and IC / Leadframe Applications:
- Cleaners
- Post-treatment to avoid
  discoloration and tarnishing
- Highly efficient anti-corrosion
  post-treatments
- Strippers

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