Electrochemical Deposition for Advanced Packaging: Spherolyte

The Spherolyte portfolio consists of pre-treatment solutions, base electrolytes, and three component additive systems used for the electrochemical deposition of copper in advanced packaging applications. Spherolyte copper chemistries include a variety of base electrolytes, as well as brightener, carrier, and leveler additives to enhance the filling performance of copper pillar, redistribution layer (RDL) and through sillicon via (TSV) structures. Spherolyte nickel and tin chemistries are used for diffusion barrier and solder joint technologies.

Features and Benefits

Spherolyte products are designed to fulfill the industry requirements for the deposited copper in packaging technologies. The process requirements vary depending on the application however there are certain characteristics of the deposited copper that are essential regardless of the technology. Spherolyte products satisfy these requirements and have demonstrated exceptional results for plating of RDL and pillar structures, and bottom-up filling of TSVs.

Reliable Metal Deposition for Pillar and Redistribution Layer

Copper

Optimal copper thickness distribution and within-wafer (WIW) uniformity
High current density plating for high throughput
Reliable gap-fill properties for superior and stable pattern plating
Low warpage and internal stress
Low copper surface roughness

Nickel

Uniform nickel distribution for diffusion barrier
Low porosity, high ductility
Enhanced deposition rate

Tin

Fine grain structure
Low organic impurities
Inhibited whisker formation

Fast and Void-Free Filling of Through Silicon Vias (TSV)

Efficient bottom-up filling of high aspect ratio TSVs
Minimal overburden with uniform copper thickness distribution
Void-free copper deposition of smallest features
Low post CMP defect density