SIT (Secondary Image Transfer) Resist

Secondary image transfer (SIT) or secondary image technology is used to protect selected areas of a PCB during surface finishing processes. After processing the protective lacquer is stripped-off. By selective protection of a board it is e.g. possible to apply immersion gold plating to contacts pads of mobile phones. Equally important is the protection of BGA or CSP contact pads during Electroless Nickel Immersion Gold (ENIG) finishing. After the process the protected pad are usually covered with OSP (Organic solder protection). Main reasons for this process is to avoid “brittle fracture” caused by inter-metallic phases during the soldering process.

Secondary Image Transfer Products
AUROSIT™ 2149 (SD2149 SIT) resist is a temporary screen printable ink stable in Electroless Nickel Immersion Gold (ENIG) (especially Aurotech) environment.
AUROSIT™ 2149 HS (SD 2149 SIT-HS) resist is a new product especially useful when long screen opening times are required (manual or semi-automatic screen-printing). The high flexibility of this product makes it as well useful in FPC processing.

Secondary image transfer features and benefits

		Application by screen-printing down to about 150 microns resolution
		Excellent adhesion on copper, solder mask and covercoats
		Protection of PCB’s during various finishing processes
		Stable in common Ni/Au plating baths (e.g. Aurotech)
		Easy and completely strippable with caustic (NaOH)
		Cost-efficient and reliable process

Secondary Image Transfer for Enig / Immersion Gold plating, Manufactured by Lackwerke Peters distributed and serviced in Asia by Atotech

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