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Semiconductor And Wafer Metallization Technologies
The Atotech Advanced Packaging group is focusing on the electrolytic and electroless metal stack deposition for wafer level packaging application.
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Advanced Packaging
The Atotech Advanced Packaging group benefits from Atotech’s international organization and logistic structure with tremendous know-how from the electronic industry at all and with our subsidiaries in more than 30 countries. We can offer to the semiconductor industry our chemical processing know-how, electrolyte production experience as well as our globally acting support structure. In our Advanced Packaging group, we focus on electroless or electrolytically generated metal interconnections for wafer level packaging application.
Miniaturization needs of interconnection technologies and corresponding higher I/O count as well as increased electrical demands on the signal path require innovative wafer level plating processes. Integrating electrodeposited copper for wafer level packaging, such as redistribution layer (RDL) and copper pillar, provides several advantages, as there are:
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Fine pitch application | |
Effective signal transmission material | | Thermal stability |
Furthermore for the cost effective production of semiconductor devices, the electroless generated bump process is providing the advantage of mask less metal stack deposition. Clearly the metal stack has to meet the functionality as under bump metallization (UBM) or over pad metallization (OPM). Here the unique Atotech electroless metal stack deposition can cope with both major application fields, such as providing a diffusion barrier for wire bonding application on aluminum and copper pads and as solderable surface finish for flip chip application. The major advantages are:
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Perfect corrosion resistance of metal tack | |
High solder joint reliability | | Improved wire bonding reliability |
For more information about Atotech Semiconductor And Wafer Metallization Technologies,
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