 |
|
|
Innovating the World of Electroplating and Electronics
|
|
Atotech is one of the world's leading suppliers of integrated production systems, chemistry and equipment for decorative and functional electroplating, semiconductor and printed circuit board manufacturing.
Additional divisions such as microstructured components, electronic materials and wafer metallization play an increasingly important part for the future growth of our company and our customers.
Our products comply with all specifications and standards defined by automotive, electrical and electronic component manufacturers.
With 14 production plants in Asia, Europe and the Americas we are never too far away to meet your demands. read more
|
|
|
 |
|
| News |
|
|
|
FerroEtch - Advanced Surface Preparation for Soldermask (No peeling off after immersion tin!) |
|
|
Atotech's 3-step system for the ultimate immersion tin PCB quality; FerroEtch (adhesion promotion), STANNAMASK (immersion tin optimised soldermask) and Stannatech (world's leading immersion tin) in combination with Atotech's unique equipment know how ensuring optimal performance for even the toughest requirements within the Industry while reducing environmental impact. Benefit from our extraordinary experience and excellence for your manufacturing needs. read more |
|
|
 |
|
|
|
Atotech, UAlbany Nanocollege Launch $5M Nanoelectronics R&D Partnership
|
|
Atotech will conduct its next-generation research and development ("R&D") in copper-plating technology as part of a $5 million program being launched in partnership with the College of Nanoscale Science and Engineering ("CNSE") of the University at Albany.
R&D activities will target chemistry development, mode of operation and analytical techniques, including online technologies, usable for computer chip, chemical and biological sensors for the health and energy industries, and biochips for medical applications. read more
|
|
|
 |
|
|
Paint Support Technologies
|
|
From paint pretreatment to paint stripping, our solutions reduce costs, improve production efficiency, and promote safer work environments while minimizing environmental impacts.
Today’s paint line manager, environmental personal and plant manager face ever more stringent air emission, chemical discharge and landfill regulations from external sources. These challenging requirements are further compounded by internal demands for lower cost, improved quality and higher efficiency.
Our PST processes are designed to offer new options to fulfill both the external and internal pressures placed on today’s paint facilities. read more
|
|
|
 |
|
|
 |
|
|
Compact CP – The Shortest Way to Direct Plating
|
|
Compact CP is the result of intensive research and development aimed to shorten and simplify the plating throughhole process. It is an available, 100% selective direct plating process based on conductive polypyrrole.
The overall process is designed for standard base materials and Resin Coated Foils (RCF), and is optimized for application in our horizontal equipment. read more
|
|
|
|
ZINTEK / TECHSEAL BLACK -
Universal Corrosion Protection for the Automotive Industry
|
|
With the zinc flake process range from KUNZ, Atotech provides a perfect complement to its product portfolio of galvanic based corrosion resistant coatings. The system ZINTEK / TECHSEAL BLACK meets especially the requirements of the automotive industry for black surfaces.
Especially developed for fasteners, the combination of ZINTEK / TECHSEAL BLACK achieves corrosion resistance values of more than 240 hours to white rust and over 1000 hours to red rust. Furthermore this combination is worldwide leading in meeting the heat resistance requirement. read more
|
|
|
 |
|
|
 |
|
SIT (Secondary Image Transfer) |
|
SD 2149 SIT is a temporary screen printable ink used to protect selected copper surfaces during Ni/Au (ENIG) and is mainly used for mobile phone board production to allow the creation of gold plated contact pads while protecting component mounting pads, which will finally be treated with an OSP surface finish.
SD 2149 SIT HS is a new product especially useful when long screen opening times are required (manual or semi-automatic screen-printing). The high flexibility of this product makes it as well useful in FPC processing. read more |
|
|
|
|
InPulse 2 – The Low Cost Solution |
|
Ever increasing demands for HDI production processes call for innovative, future-oriented solutions. The new InPulse 2 copper plating system extends the limits of horizontal plating technology to a new dimension. With its full range of major technical improvements like minimum anode/cathode distance, wide area contact system segmented anodes and matching electrolyte InPulse 2 is well prepared for tomorrow's plating challenges.
The process enables "Super Filling" which gives unrivalled productivity and blind micro via filling with half the copper plating thickness in comparison to standard processing. read more |
|
|
 |
|
|
|
Cuprapulse – A Quantum Leap for Copper Plating
|
|
|
During copper plating in DC, high current density areas, e.g. board edges or non shielded areas, are plated much thicker. Simultaneously in low current density areas e.g. in the center of the hole, less copper is deposited. In the past attempts were made to overcome these problems by modifying organic additives, or the inorganic composition and by tailoring the tank configuration. With the development of a reliable pulse rectifier now an additional “electrical tool” can be employed. read more
|
|
|
 |
|
|
 |
|
|
The Final Finish: Conversion Coatings and Sealers
|
|
Post-treatments are applied as supplementary finishes to impart many beneficial and essential characteristics to a zinc or zinc alloy coating. They passivate or cover the surface of the coating with a thin film that provide end-user benefits such as colour and increased corrosion protection.
Traditional chromates based upon hexavalent chromium are available in a variety of colours. Different chromate colours indicate changes in the thickness and composition of the film, which influence the level of corrosion protection that will be achieved. read more
|
|
|
|
|
Ni/Pd/Au Preplated Leadframes (PPF) Plating - Reliable Ultrathin Layers with Predictable Thickness
|
|
The majority of ICs use leadframes for the dual role of electrical connection between IC die and PCB together with the mechanical support to the die during final product assembly. Preplated leadframes are supplied by the leadframe manufacturer and plated well before die attachment and assembly, eliminating the need for post mold treatment.
Due to the 2006 EU legislation, imposing lead-free production for most electrical and electronic components, the IC/ leadframe industry is also eagerly looking for solderable alternatives.
Atotech offers a NiPdAu system combining operating benefits and process efficiency, in particular high solderability, wire bondability, and trim/form performance. It includes the pretreatment (cleaning and activating of leadframes) as well as a posttreatment step to ensure no epoxy bleed out (EBO). read more
|
|
|
 |
|
|
 |
|
Environment
|
|
As one of the world’s leading suppliers for process chemistry, equipment, know-how and service to the electroplating industry, Atotech assumes significant responsibility in setting benchmarks in the development of environmentally sound chemical systems.
Therefore, ecological acceptance, maximum safety, high performance, quality and profitability are equal in importance to Atotech's GMF product development. read more
|
|
|
|
|
More Atotech Homepages Worldwide: |
|
|
Europe, FarEast, Australia / New Zealand, Austria, Brazil, China, Czechia, France, Germany, India, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Scandinavia, Singapore, Slovenia, Spain, Taiwan, Thailand, United Kingdom, USA, Vietnam |
|
|
 |
|
|
|
|
|
