Via-hole Filler
Via-hole fillers of the SD 2361 Series and photoimageable types of the ELPEMERŪ VF 2467 Series add safety to printed circuit boards. In contrary to soldermask, often used to fill via holes, both products contain 100% solids. Consequently problems with bubbles or burst caused by remaining solvent as well unwanted shrinkage does practically not occur. Both via hole filler products are applied by screen printing and show an excellent behavior in all soldering processes.
Via Hole Fillers Application
Thermal curing via-hole fillers of the SD 2361 series is usually applied after the soldermask process and sometimes after HASL. The holes are reliably closed. In contrary the photoimageable VF Series is applied before the soldermask process by screen-printing. All further processing is done together with standard soldermask after its application.
Via Hole Fillers Features and Benefits
 |  | Excellent paste adhesion to Cu in via | | | Reliable filling of all holes typically up to 0.8 mm | | | Stable during soldering, wet or vacuum processes (no penetration of and substance through the holes) | | | Avoid flux residues in via holes | | | Ensure proper conditions for in-circuit electrical tests | | | Especially qualified and used for automotive boards with high safety standards |
Overview most important Products (for details contact our local or global sales staff)
Product Name |
Properties & Explanations | | |
SD 2361 |
1 K thermal curing system, 100% solids, solder bath resistance
20 s @ 265°C, 10 s @ 288 °C, thixotropic |
SD 2361 T |
1 K thermal curing system, 100% solids, solder bath resistance
20 s @ 265°C, 10 s @ 288 °C, thixotropic |
SD 2768 NB (new) |
2 K via-hole filler especially for via in pad application,
NB = no bleeding into metal, UL 94 V0 approved,
excellent solder bath resistance 20 s @ 288°C |
ELPEMERŪ VF2467 |
Photoimageable 2 K system, 100% solids, solder bath resistance 20 s @ 265°C, 10 s @ 288 °C, UL 94 V0 approved |
Via hole fillers, Manufactured by Lackwerke Peters distributed and serviced in Asia by Atotech
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