by Markus Lehr | Mar 20, 2018 | Press releases
Coverage performance comparison vs. Neoganth® B Pre Dip on 4 different base materials (Isola IS410, Panasonic R1755C, Nanya NP140, Shengyi S1141) after new make-up, throughput and with maximum drag-in of Neoganth® W Pre Dip into the subsequent activator bath Berlin,...
by Markus Lehr | Mar 12, 2018 | Tradeshows and events
InPro® THF: Current density: 1.5 A/dm², dimple < 5μm [/et_pb_text][/et_pb_column][et_pb_column type="2_3"][et_pb_text admin_label="Atotech presents new solutions for (a)mSAP applications at CPCA 2018" background_layout="light" text_font_size="18" border_style="solid"...
by Markus Lehr | Mar 7, 2018 | Press releases
Atotech’s MultiPlate® for Power IC Berlin, 6 March, 2018: Atotech announced that it will present and exhibit at Semicon China 2018 to be held in Shanghai from March 14 to 16, 2018. On Friday, March 16, from 11:30 to 11:45 am, Cassandra Melvin, Global Product Manager...
by Markus Lehr | Mar 5, 2018 | Press releases
Atotech adds Vice President HR position to the senior management team Daniel Wan will drive strategic HR initiatives and develop the HR function globally Berlin, 5 March, 2018: Atotech reinforces its strategic positioning in the HR organization by adding Daniel Wan as...
by Markus Lehr | Mar 1, 2018 | Press releases
Atotech’s revolutionary new tool called MultiPlate® for FOPLP Berlin, 28 February, 2018: At the upcoming IMAPS Device Packaging Conference 2018 next week, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging...
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