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Start now congress – the future of electromobility || General metal finishing

Start now congress – the future of electromobility || General metal finishing

by Katharina Stier | Jun 28, 2018 | Tradeshows and events

From July 4-5, 2018 the “Start now” congress will take place in San Sebastian. Ernesto Salazar, Global Product Director DECO & POP at Atotech, will talk about challenges and opportunities of electric vehicles for the surface engineering industry. Since decades...
SMT>32 International Conference on Surface Modification Technologies || General metal finishing

SMT>32 International Conference on Surface Modification Technologies || General metal finishing

by Katharina Stier | Jun 25, 2018 | Tradeshows and events

Werner Richtering will host the plenary “Decorative and functional coatings for automotive applications” on Thursday, June 28, 9.30 -10.10 in room 1 Atotech is this year’s name sponsor of the SMT>32 main conference hall. Here we will present the latest developments...
Fastener Fair Mexico || General metal finishing

Fastener Fair Mexico || General metal finishing

by Katharina Stier | Jun 20, 2018 | Tradeshows and events

Automotive fasteners require the most sophisticated corrosion protection coatings. Atotech offers a wide spectrum of coating technologies that meet the specifications of many OEMs and are approved by automotive manufacturers worldwide. Our technologies include...
“The changing shape of the HDI market” at the EIPC’s 50th anniversary conference || Electronics

“The changing shape of the HDI market” at the EIPC’s 50th anniversary conference || Electronics

by Markus Lehr | Jun 15, 2018 | Tradeshows and events

Cross section through Apple iPhone X assembly, showing InFo package mounted onto the mSAP HDI substrate Berlin, 15 June, 2018: Atotech is pleased to announce its participation in the EIPC Summer Conference 2018. With two presentations, one in the Keynote Session on...
Cupracid® Flex and InPro® Flex: Advanced copper plating processes for Flex-PCBs || Electronics

Cupracid® Flex and InPro® Flex: Advanced copper plating processes for Flex-PCBs || Electronics

by Markus Lehr | Jun 14, 2018 | Press releases

Excellent throwing power: Board thickness: 0.3mm, Hole: 0.15mm, CD: 2.8ASD, Line speed: 0.6m/min, Flow rate: 15HZ, Average TP% : 120% Berlin, 14 June, 2018: The flex/ flex-rigid PCB market continues to grow as more and more designs call for flexible inner layers with...
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