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Atotech to present a series of new processes at the IPC APEX Expo 2019 || Electronics

Atotech to present a series of new processes at the IPC APEX Expo 2019 || Electronics

by Markus Lehr | Jan 22, 2019 | Press releases

Printoganth® T1: Horizontal high throw electroless copper for amSAP technology Berlin, 23 January, 2019: Atotech is one of the world’s leading suppliers of specialty chemicals and equipment for the printed circuit board, package substrate and semiconductor industry....
A new series of panel level plating processes and equipment for high resolution pattern plating || Electronics

A new series of panel level plating processes and equipment for high resolution pattern plating || Electronics

by Markus Lehr | Jan 15, 2019 | Press releases

MultiPlate® Panel – Next generation plating system and Innolyte process family for panel level packaging NovaBond® EX – Build-up dielectrics and solder resist materials: Excellent and stable performance after thermal stress for a wide range of ABF...

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  • Atotech to present at the 17th International Wafer-Level Packaging Conference 2020 || Electronics

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