by Xenia Karasev | Jan 22, 2019 | Press releases
Printoganth® T1: Horizontal high throw electroless copper for amSAP technology Berlin, 23 January, 2019: Atotech is one of the world’s leading suppliers of specialty chemicals and equipment for the printed circuit board, package substrate and semiconductor industry.... 
by Xenia Karasev | Jan 15, 2019 | Press releases
MultiPlate® Panel – Next generation plating system and Innolyte process family for panel level packaging NovaBond® EX – Build-up dielectrics and solder resist materials: Excellent and stable performance after thermal stress for a wide range of ABF... 
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