Adhesion promoter for plating
on organic and inorganic materials
- Technology for direct metal deposition on molding resin
- Adhesion promoter for plating on glass
- Plating on molding compounds
- Plating on glass
- Enabling technology for direct metal deposition on molding resin: Booster® MR is a unique wet-chemical adhesion enhancement process for primer-less metal plating directly on molding resins. Direct plating on molding resin enables applications for conformal electromagnetic interference (EMI) shielding and “direct circuit formation” on molding resins, such as for FO WLP (FO PoP, FO SiP). The Booster® MR process can handle singulated and strip based products, using tape carriers to prevent the I/O side from being attacked by the plating solutions.
- Adhesion promoter for plating on glass: Atotech’s VitroCoat GI is a new and innovative adhesion promoter that enables wet chemical metal deposition on glass. It can be applied using a short, simple, cost effective dip-coating method. VitroCoat GI’s key advantage is unparalleled coverage in high aspect ratio through-vias versus competing processes such as PVD.
Did you know?
CovaBond MR is a unique wet-chemical adhesion enhancement process for primer-less metal plating directly on molding resins.
The CovaBond MR process can handle LGA and BGA packages, using tape and ink-based carriers to prevent the I/O side from being attacked by the plating solutions.
A New Reliable Adhesion Enhancement Process for Directly Plating on Molding Compounds for Package Level EMI Shielding
2015, PDF, 1.400 KB
Plating on molding compound is a relatively new field which could open up new package designs. One major application is conformal self EMI shielding (package level shielding) of ICs. Generally, EMI shielding is done mainly by metallic cans, however, this technique increases the space requirements and reduces flexibility of component layout on the PCB, that would not be suitable to handset products.
Electroless and electrolytic copper plating of glass interposer combined with metal oxide adhesion layer for manufacturing 3D RF devices
2016, PDF, 2.550 KB
With the recent commercialization of carrier aggregation, RF far front end filters require reduced size of inductors and capacitors while keeping high quality factors. High performance RF multiplexers have low insertion loss and rejection at certain frequencies which can be achieved by reducing the electromagnetic coupling between components. To meet this stringent filter requirement three-dimensional (3D) RF inductor-capacitor (LC) filters have been fabricated on through-glass-via (TGV) and on a glass substrate surface.
We have successfully integrated the adhesion layer and electroless and electrolytic copper plating technologies into semi-additive process (SAP) and built up a 3D RF front end filter devices on 400 μm thick 200mm diameter glass wafers as well as 300mm x 300mm glass panels with 80 μm diameter holes.