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Atotech’s MultiPlate®

Berlin, 11 September, 2017: Atotech is amongst the leading metallization companies in the semiconductor industry, providing cutting–edge chemistry, equipment and process solutions for advanced wafer metallization.

As such, Atotech’s experts will showcase the company’s market leading knowledge on fan-out wafer-level packaging at two presentations during this year’s SEMICON Taiwan 2017:

  • On Thursday, September 14, from 11:00 to 11:30 am, Cassandra Melvin, Global Product Manager Semiconductor Advanced Packaging at Atotech Deutschland GmbH, will present “Optimized Cu plating for fan-out wafer-level packaging” at the TechXPOT, the best platform to learn the latest industry knowledge
  • On Friday, September 15, from 15:50 to 16:15 pm, Dr. Dirk Rohde, R&D Manager Electronics at Atotech Deutschland GmbH, will speak about “Additive impact on Cu properties for fan-out wafer-level packaging applications” at the SiP Global Summit – Embedded and Fan Out Package Technology Forum

In her presentation, Cassandra Melvin will focus on the challenges for Cu electroplating in next generation fan-out wafer-level packaging (FO-WLP). She will introduce Atotech’s MultiPlate® as turnkey solution for these challenges and present the results achieved on tall Cu pillar wafers with this ECD tool, proving that MultiPlate® provides top plating performance and clear technical advantages.

Dirk Rohde will present next generation device requirements such as a continuously decreasing RDL pitch and increasing I/O count, and the challenges related in plating such fine features. In his presentation “Additive impact on Cu properties for fan-out wafer-level packaging applications” he will discuss how additives on the molecular scale impact Cu microstructures and provide the audience with the results achieved with a new electrolyte.

Atotech’s specialists are ready to discuss the company’s innovative solutions for the semiconductor industry following the presentations and during the trade show.

With the Taiwanese equipment and material market forecast to reach more than USD 18 billion, SEMICON Taiwan is the premier event for microelectronics in Taiwan. The trade show will be held in Taipei, Taiwan, from September 13 to 15, 2017.