Leading surface technologies for


connectors, leadframes and IC outer leads

Our product portfolio

Pallacor HSN Plus

Cost optimized Pd/Ni process as an alternative to thick Au deposits


A stack of NiPd/flash Gold is a cost-effective alternative to thick Au layers

Lower process costs

due to reduced Pd concentration (13-17 g/l) compared to conventional Pd/Ni electrolytes

Stable alloy composition

Of 80:20 % Pd/Ni

Pallacor® HSN Plus – reliable and hard silver process for connectors and bus bars.

  • Cost effective through reduced Pd content leads to lower cost for make up and drag out
  • Cost effective through lower density of Pd/Ni as Gold, 11g/cm3 vs 19 g/cm3
  • Robust process with an exceptional stability of more than 20 MTO
  • Applicable for high speed application (spot plating with up to 80 ASD)
  • Works in spot, wheel & brush plating tools
  • Simple and reliable process control – very large working window
  • Improved ductility
  • Constant alloy composition over the entire working window

  • High-end IC substrates based on SAP technology
  • IC substrates using amSAP technology

60/40 μm BMV on ABF GX-92 with 80% TP into the wedges

  • Vertical electroless copper process for amSAP and SAP technology
  • Excellent coverage and adhesion on ABF GX, GY and GZ series as well as BT-PCF materials
  • Favorable internal stress characteristics for outstanding non-blistering performance
  • High purity in copper deposit resulting in low resistivity for good via filling performance
  • All standard reliability requirements are fulfilled

What inspires us

Why we developed Printoganth® MV TP1

Your challenge

The next generation of IC substrates requires finer L/S than current technologies. In order to achieve this goal, the copper on the surface needs to be minimized in order to reduce the differential etch – which is the limiting factor for L/S resolution. At the same time, a specific minimum thickness of the electroless copper layer is required in the bottom of the BMV (on the capture pad) for the subsequent pattern plating process.

Our solution

Printoganth® MV TP1 is Atotech’s answer to increasing miniaturization requirements derived from the semiconductor industry that are cascaded down especially to the high-end IC Substrates market. Printoganth® MV TP1 features a superior throwing power performance enabling the reduction of electroless copper deposition thickness while ensuring highest process safety. Furthermore, the dry film adhesion on Printoganth® MV TP1 copper deposits is excellent and the copper layer is etched very fast during the differential etch.

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