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Atotech an MKS Brand
  • On-demand
    A variety of technologies, including thermo-conductive paste plugging and electrolytic copper plating, are used to fill through vias in package substrates and printed circuit boards. Electrolytic copper plating, especially with pure metallic coppe...
  • On-demand
    The construction industry has undergone a remarkable transformation in recent years, influenced by supply chain disruptions, rising energy and material costs, and a growing desire for environmentally friendly practices. In this dynamic environment...
  • On-demand
    Silver has become an essential metal finish for connectors, switches, busbars, and similar technologies due to its superior conductivity and significantly lower price compared to gold. The silver coatings market offers a variety of solutions, rang...
  • On-demand
    Today, Industrial digitalization is not a buzz any longer, but has become central to modern operations. As a key supplier to the electronics; semiconductor, package substrate and PCB industries we have understood that we can deliver an important c...
  • On-demand
    In today’s world with its increasing demand for power semiconductor devices for electrification, e-mobility, and enabling the flexible use of green energy it has become more and more imminent that it is not only necessary to involve new semiconduc...
  • On-demand
    Chemical regulations around the world are heralding the end of conventional hexavalent hard chrome plating. As one of the world's leading suppliers of hard chrome processes, we have been dedicated to developing sustainable hard chrome plating proc...
  • On-demand
    Electroless palladium plating finds its application in the plating of ENEPIG (Electroless nickel/electroless palladium/immersion gold) or EPAG. But although those finishes offer multiple benefits with wide soldering and bonding capabilities a majo...
  • On-demand
    Wear resistant coatings are vital in applications where durability is crucial. These thin coatings effectively reduce friction and minimize mass loss during dynamic motion.

    We've introduced BluCr®, the first Cr(VI), PFOA, and PFAS-free hard chro...
  • On-demand
    Driven by an increase in design complexity and growing demand for high input and output in package substrates, the dimension of conductor tracks line and spaces is predicted to be reduced gradually to 5/5 µm and lower. The conventional approach to...
  • On-demand
    Is it possible to operate an electroless nickel process at 75 °C and still achieve the required plating speed?  Yes, it is – with our revolutionary low-temperature mid-P EN process Nichem® MP 75.

    Compared to conventional electroless nickel system...
  • On-demand
    The Semi Additive Process (SAP) enables very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and spaces (L/S) of 10/10 µm and less the copper thickness variation is one of the cr...
  • On-demand
    Mixed reaction gold electrolytes with high autocatalytic portions are gaining more and more market acceptance. Already in 2010, Atotech introduced the first gold electrolyte with autocatalytic properties Aurotech® G-Bond for ENEPIG applications. W...
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