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NeoLink® E

A milestone in
direct plating on plastics

High productivity

Short and efficient metallization of plastics

Excellent quality

High quality processing for ABS and ABS/PC blends

Stable conductivity

High and stable conductivity on ABS and ABS/PC blends

Direct plating plastics Neolink

  • Reduced number of process and rinsing steps
  • Higher conductivity before acid copper
  • Less Pd in the activator working bath
  • Versatile process that can be used for ABS and ABS/PC, also suitable for large parts
  • Easy integration into existing electroplating equipment
  • Complies with the requirements of the automotive, sanitary and fashion industries worldwide
Automotive_low Sanitary_low White goods_low

  • Suitable for plating on ABS as well as ABS/PC blends
  • Meets the most demanding requirements of the automotive, sanitary and fashion industries worldwide

NeoLink® E

High quality, short and efficient metallization of plastics

 

With Neolink® E, Atotech has reached a crucial new milestone in direct plating on plastics. Much shorter than conventional plating systems for plastic materials, NeoLink® E ensures fast metal deposition on ABS and ABS/PC blends with no need for electroless Ni and Ni or Cu strike.

NeoLink® E is designed to work with low palladium content in the activation system. The low palladium formulation of NeoLink® E activators allows for minimized drag-out costs.

Conventional plating systems usually remove tin and tin chloride after activation in the accelerator step in order to expose palladium. NeoLink® E replaces tin with copper and generates an autocatalytic growth of copper oxide crystals on the surface. That further increases the conductivity of the plastic material resulting in easier acid copper deposition as well as allowing for further palladium reduction in the activator solution.

Easily integrated into existing lines, NeoLink® E removes the need for electroless nickel, any preplate or nickel and copper strike immediately. This consequently improves productivity and the reliability of the production.

What inspires us

Why we developed NeoLink® E

Your challenge

Direct plating on plastics offers many advantages. It is a fast, resource-saving alternative to conventional plating systems. However, the challenge lies in reducing the process’s high palladium consumption.

Our solution

Our direct plating process NeoLink® E provides customers with considerably higher productivity compared to conventional systems. The low palladium formulation of NeoLink® E activators reduces costs. Additionally, the cu-link NeoLink® E increases conductivity allowing for palladium reduction in the activator solution.

Main process steps

Direct plating NeoLink® E

Cleaning (optional)

Etching

Cr(VI) reduction

Pre-dip

Activation

Cu-link

Electroplating

Etching

Etching is an essential step to achieve good metal adhesion during electroplating. In order to get a perfectly conditioned surface prior to activation, etch parameters must be adjusted to base material specifications. NeoLink® E Additive CR offers optimal etching for all ABS and ABS/PC blends.

Neutralization

Cr(VI) ions carried over from the etching bath may interfere with the final electroplating step. That is why they must be reduced to Cr(III) before activation. NeoLink® E Reducer CR reliably accomplishes this task, providing an important protection for the entire process sequence.

Pre-dip/activation

Since the hydrochloric acid in the pre-dip solution has the same concentration as in the activation bath, there is no need for rinsing between the two steps. NeoLink® E Activator contains Pd/Sn colloids stabilized with tin chloride. During activation, tin and palladium are adsorbed on the surface of pretreated base materials.

Cu-link

Unlike conventional systems, which usually remove tin and tin chloride from the surface in order to expose palladium, NeoLink® E replaces tin with copper. As a result, copper is able to link to palladium, providing the surface with a high and stable electrical conductivity that allows for direct acid copper plating. Additionally, the cu-link NeoLink® E increases conductivity allowing for palladium reduction in the activator solution.

NeoLink® E

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