The complete line of final finishes

for today’s and future market needs

Our product portfolio

Final finishing

Coping with the harsh environment of multiple Pb-free soldering
with a complete line of final finishes

Quick facts

  • Highest global market share for final finishing
  • Complete portfolio of final finishes
  • Production proven lead free processing
  • OEM relevant development


  • ENIG
  • EPAG
  • Immersion Tin

Product portfolio

Electroless Nickel / Immersion Gold (ENIG)

Advanced ENIG using Aurotech® Plus

  • Aurotech® Plus: An Atotech optimized ENIG process that is designed specifically with high end HDI manufacturing in mind. Dramatically reduced in nickel corrosion, minimized extraneous nickel plating and outstanding soldermask mask and base material compatibility, are all primary benefits. Whilst technically assured; Aurotech® Plus offers cost saving through extended lifetimes, excellent distribution and process control.
  • Aurotech® HP: An ENIG process developed especially for the high corrosion resistance requirements of mobile handset manufacturers. Its nickel layer with high phosphorous content provides significantly better protection versus an aggressive environment than conventional nickel layers with mid or low P-content. The process is qualified and in mass production for the world’s leading cellular phone fabricators.
  • AuNic®: A drop-in process for existing standard ENIG lines. It consists of five main steps: cleaning, micro-etch, activation, electroless nickel and immersion Gold. The most distinguishable feature of AuNic® is the introduction of the additive AuNic® EN C, which is added for bath make-up and after idle times instead of performing dummy plating.

Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG)

Aluminum bonded connection on a Universal Finish SolderBond® coating

  • Universal ASF II: A final finish for IC-substrates, which performs better than ENEPIG with PdP in terms of Au-wire bond pull forces even with a lower gold thickness.
  • Universal Finish SolderBond®: A process for PCB´s and high reliability applications, which can provide three surface finishes, depending on the process sequence. The palladium layer is pure. No phosphorus is co-deposited The PCB manufacturers can choose the process, which give them the most benefit, because the existing Aurotech® CNN ENIG process can be updated to an ENEPIG Process.

Electroless Palladium Autocatalytic Gold (EPAG)

Cu – wirebond on EPAG

  • PallaBond®: A new direct Palladium surface finish process with an optional gold layer. The PallaBond® process allows the direct deposition of palladium on copper, without using any nickel and offers 2-3 times more production capacity because of shorter deposition time compared to ENEPIG.

Other benefits are:

  • Enables wire bonding with Cu, Cu-Pd, Au and Ag wire
  • Thickness < 0,2µm allowing very fine L/S
  • Less water consumption because of easier, shorter process
  • Less energy consumption because of low process temperatures
  • No nickel chemistry waste

Immersion Tin

Functional high volume finish

  • Stannatech® 2000 H and V: The Industry benchmark for immersion tin for multiple Pb-free soldering and press-fit technology. Within the electronics industry immersion tin is recognized as a reliable surface finish for both PWBs and IC substrate applications. The leading immersion tin process is combining chemistry process and system technology for horizontal and vertical equipment.
  • Stanna-Q®: The process Stanna-Q® is an immersion tin process for QFN packages (Quad Flat No Leads Package). The process covers the exposed leadframe copper on the side of the QFN package by immersion tin in order to form a solder fillet during assembly.

Horizon Stannatech® 2000

The market leading immersion tin for the automotive industry, with over 10M m² being processed each year

Stannatech® 2000 offers the unique combination of chemical process and state of the art equipment from a single pool of expertise.

  • Stannatech® 2000 is mass production proven and is qualified by the leading automotive end users
  • Stannatech® 2000 offers unequalled process control and m²/l production capacity by employing auxillary equipment: Crystallizer™ and ConStannic™
  • The experience gained from Stannatech® 2000 has facilitated the development of an i-Sn process for IC substrates and QFN production: Stannatech® IC and Stanna-Q® respectively
  • Immersion tin is also a cost effective option for the emerging wearable market

Read more

“We offer the market final finishes that are systematically and statistically developed whilst reflecting the current requirement for technology based solutions. Specific cost and reliability requirements are all factored into our portfolio.”

Rick Nichols, Global Product Manager Final Finishing, Atotech Germany

Recent publications

Is it possible to use markers to select the right soldermask to optimize the yield of your selective finish?

2015, PDF, 650 KB
The selective finish is the final chemical step of the PCB manufacturing process, this is when the panels are at their most valuable and are unfortunately not re-workable.
This paper will focus on the chemical characteristics and use them to predict or identify potential issues before they occur rather than specifically name ‘critical’ soldermasks. It is also the intention of this article to address the potential of a soldermask to react to common yield hiking practices like UV bumping.

Is high phosphorus content in the nickel layer a root cause for “black pad” on ENIG finishes?

2013, PDF, 1,100 KB
The “black pad” phenomenon is known as a failure mode related to PWBs with an electroless nickel / immersion gold (ENIG) surface finish.
This paper focuses on one specific question: “Is the phosphorus content of the nickel layer of an ENIG surface finish the root cause for black pad?” The results show that high P ENIG is underestimated in regard to its capabilities in the market.

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