Berlin, March 20, 2026 — MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech (process chemicals, equipment, software, and services) and ESI (laser systems) will present their latest manufacturing solutions for printed circuit board (PCB) and package substrate production at the CPCA Show. The exhibition will take place March 24-26 at the National Exhibition and Convention Center, Shanghai.
The CPCA Show is recognized as one of China’s most influential exhibitions for PCB and substrate manufacturing, bringing together leading domestic producers, global suppliers, and technology innovators at a time when the country’s rapid growth in EVs, AI servers, advanced packaging, and 5G/6G infrastructure is driving unprecedented demand for higher‑precision interconnect solutions. At booth 8C01, MKS will present a comprehensive portfolio that spans precision chemistry, advanced plating systems, laser drilling platforms, optics, motion control, IIoT software, and training services — an integrated offering that supports the company’s proprietary Optimize the InterconnectSM approach and addresses China’s accelerating need for miniaturization, higher interconnect density, reliability, and next‑generation electronics performance.
Enabling Next‑Gen PCB Performance
“China remains the global powerhouse of PCB production, contributing more than half of global output and continuing to accelerate innovation across nearly every electronics segment,” said Eddy Chen, Marketing Manager Electronics Greater China at MKS’ Atotech.
“As customers push toward finer L/S, more complex stack‑ups, and higher reliability under demanding thermal conditions, MKS’ Atotech is committed to supporting China’s electronics manufacturers with cutting‑edge, sustainable manufacturing technologies.”
Technology Highlights
MKS’ Atotech will feature a broad range of advanced process and equipment solutions, including:
Chemical Process Innovations (Atotech Products)
- Printoganth® MV TP2 / TP3 – High throwing power, vertical e-less Cu for SAP / amSAP technology enabling the ultra-thin copper deposition that is essential for fine features down to 2/2 µm L/S
- Printoganth® P2 – Advanced horizontal electroless copper process offering superior throw into blind microvias and nano-void-free deposits for high-frequency and flexible applications
- Cupraganth®MV Activation – Pd-free copper activation revolutionizing advanced packaging
- Inpulse® 2THF2 – Through via filling for IC/CSP substrate
- InPro® SAP7 – Next gen package substrates via filling with highest uniformity
- InPro® Pulse TVF – Enhances thermal management for 5G and LED applications, ensuring reliability and productivity
- Aurotech® G-Bond 3 – Versatile gold plating solution supporting Ni/Au, Ni/Pd/Au, and Pd/Au finishes
- Stannatech® 2100 – Cost-effective, high-quality immersion tin plating with excellent whisker control and solder reliability
- Pallabond® 2 – Electroless palladium (pure), and autocatalytic gold process for fine L/S and HF applications
- Universal Finish Solderbond – ENEPIG for soldering, gold- and aluminum-wire bonding for PCB’s
- Novabond® PX-S2 & BondFilm® HF1000 VS – Advanced bonding enhancement processes tailored for high-speed AI, HPC, and high-frequency designs
Equipment Solutions (Atotech Products)
- vPlate® – The gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
- Uniplate® PLBCu6 – Inline process from desmear to flash plating for mSAP for high end HDI boards
- POLYGON PLB LINE® – Excellent BMV capability enabling HDI PCB production
- Digital Factory Suite – Cutting-edge industrial digital solutions that drive customer performance and reduce operational costs
Laser Platforms (ESI Products)
- Geode™ Platform Solutions – Advanced CO₂ and UV laser systems for PCB and package substrate via formation.
- Geode™ G2 – Next-generation CO₂ laser drill engineered for precision HDI and IC packaging applications.
- CapStone™ Flex PCB laser drill – Breakthrough productivity – Increase throughput up to 2x and reduce overall processing costs by 30%
Enabling High-Performance Interconnect Manufacturing
By combining laser drilling, advanced metallization, precision plating, optics, and digital control software, MKS delivers an integrated manufacturing ecosystem that enables PCB and substrate manufacturers to achieve higher‑density interconnects, improve electrical and thermal performance, increase production reliability, reduce overall cost‑of‑ownership, and scale high‑volume output for AI, automotive, server, and consumer electronics markets. This seamless integration of chemistry, equipment, and laser technology is particularly relevant in China, where manufacturers increasingly adopt full‑line, single‑supplier ecosystems to enhance yield, simplify production flows, and accelerate time‑to‑market.
Event Details
Conference: CPCA 2026
Date: March 24-26, 2026
Booth: 8C01
Venue: National Exhibition and Convention Center (NECC), Shanghai
For more information on Apex Expo, please visit: Shanghai Ying Zhan Exhibition Service Co., Ltd.