Printoganth® MV TP3
Next-generation electroless copper for SAP build-up technology
Ultra-low thickness capability
Enables copper layers as thin as 100 nm while maintaining uniformity and performance.
Uniform and dense copper deposit
Advanced stabilizer system ensures highly controlled, predictable deposition across the full thickness range (100–500 nm).
Excellent adhesion performance
Delivers strong peel strength, even on smooth ABF laminate types like GX-92R and GX-T31.
Printoganth MV TP3 is the newest evolution in the high-throwing-power Printoganth MV TP series of electroless copper baths developed for SAP (Semi-Additive Process) build-up technology.
As IC substrates continue to push the limits of finer line-and-space dimensions, reliable electroless copper becomes increasingly critical. Printoganth MV TP3 is optimized to meet these challenges with dense, uniform copper deposition and exceptional adhesion performance — even on very smooth laminate surfaces.
- Enables ultra-low copper thicknesses down to 100 nm with excellent uniformity.
- Provides strong adhesion performance even on very smooth ABF laminate surfaces.
- Offers a broad operational range from 100 to 500 nm for flexible process control.
- Incorporates a novel stabilizer system for highly controlled, predictable deposition.
- Delivers a dense, fine-grained copper structure that supports bottom-up recrystallization.
- Ensures outstanding interconnect reliability for advanced substrate applications.
- Achieves high peel strength under both standard and low-roughness desmear conditions.
- Achieves high peel strength under both standard and low-roughness desmear conditions.
- Provides stable bath performance with reproducible results across production runs.
- Combines uniform metallization, simplified operation, and enhanced yield for next-generation IC packaging
What inspires us
Why we developed Printoganth® MV TP3
Your challenge
In the ongoing evolution of IC substrates, designers face the dual challenge of miniaturization and material change. As line and space dimensions shrink, the roughness of dielectric surfaces such as ABF materials must also decrease to achieve the necessary precision. However, smoother substrates significantly reduce mechanical anchoring of the electroless copper layer, making it difficult to maintain strong adhesion and reliability.
At the same time, the need for thinner, uniform copper deposits (often below 500 nm) introduces process instability in traditional electroless copper systems. These challenges create a critical demand for a process that combines extreme thinness, uniformity, and robust adhesion – without compromising reliability or process simplicity.
Our solution
We developed Printoganth® MV TP3 as the latest generation in our high-throwing-power electroless copper portfolio to meet precisely these needs. The process features a new stabilizer system that ensures highly controlled and predictable copper deposition, even at ultra-low thicknesses of 100 nm. This enables the formation of a dense, fine-grained copper layer that adheres exceptionally well to smooth ABF laminates and supports “bottom-up” recrystallization – a key factor for interconnect reliability. By combining chemical innovation with proven process know-how, Printoganth MV TP3 delivers uniform copper distribution, excellent adhesion, and no need for dummy plating, helping customers achieve consistent performance, simplified production, and readiness for the next generation of advanced packaging designs.