ViaKing®: MKS’ Atotech’s graphite based metallization process
Surface-Treatment Technology
BondFilm® HP: High performance alternative oxide for lower sludge, higher copper loading, and reduced COD.
BondFilm® EX-S2: Bonding enhancement solution for low signal loss with high-frequency applications.
CupraEtch® SR 8000: Advanced cupric chloride based pretreatment for soldermask and dryfilm – reduced sludge, longer bath life, and higher roughness with minimal copper removal.
InkPromoter T15: Surface pretreatment for ink-jet printed solder mask applications.
Selective Finishing
Aurotech® G-Bond 3: New gold electrolyte with autocatalytic properties and non-toxic stabilization.
PallaBond®: Ideal Ni free final finish for fine line and high frequency applications. Solderable & gold wire bondable.
Stannatech® SF8 V2: Ideal Immersion tin bath with reduced solder mask attack, low foaming, & improved rins-ing over standard ISn baths.
Atotech India Private Limited UNIT No. 209, Krishna Commercial Center 6 Udyog Nagar, Off S. V. Road, Goregaon West Mumbai, Maharashtra - 400062 India
Tel.: +91 22 2878 3400 Fax.: +91 22 2878 8278
Chennai
Sales office
Atotech India Private Limited 303, SIDCO AIEMA Tower, 1st Main Road Ambattur Industrial Estate Chennai - 600 058 Tamil Nadu India
Tel.: +91 44 4852 8963 / +91 96 000 71 757
Indonesia
Jakarta
Sales office
PT. Atotech Indonesia Chemicals The Suite Tower level 7 – Union Space SO 1 Jkt outer Ring Road No. 1, RW.2 Kamal Muara, Kec. Penjaringan Jakarta Utara 14470 Indonesia
Atotech (Philippines) Chemicals, Inc. 401-402 B2 L7 CTP Alpha Building Investment Drive Madrigal Business Park Alabang, Muntinlupa City Philippines, 1780
