Panel and Pattern Plating
- Cupracid® TP5: Electrolytic copper plating process for conventional hoist type DC equipment using soluble anodes.
- Cuprapulse® IN: Reverse pulse plating with insoluble anodes for HDI and MLB.
Plating Through Hole
- Noviganth® AF 76: High build self accelerating electroless copper which is a perfect drop-in solution for many PTH line sin the U.S.
- Printoganth® U-HT: High reliability electroless bath for blind microvia plating.
- Securiganth® E & Sweller HP<: NMP-Free swellers for difficult-to-process laminates.
- ViaKing®: MKS’ Atotech’s graphite based metallization process
- BondFilm® HP: High performance alternative oxide for lower sludge, higher copper loading, and reduced COD.
- BondFilm® EX-S2: Bonding enhancement solution for low signal loss with high-frequency applications.
- CupraEtch® SR 8000: Advanced cupric chloride based pretreatment for soldermask and dryfilm – reduced sludge, longer bath life, and higher roughness with minimal copper removal.
- InkPromoter T15: Surface pretreatment for ink-jet printed solder mask applications.
- Aurotech® G-Bond 3: New gold electrolyte with autocatalytic properties and non-toxic stabilization.
- PallaBond®: Ideal Ni free final finish for fine line and high frequency applications. Solderable & gold wire bondable.
- Stannatech® SF8 V2: Ideal Immersion tin bath with reduced solder mask attack, low foaming, & improved rins-ing over standard ISn baths.
- Uniplate®: (P, LB, CP/NP, IP2) Desmear, e‘less, direct, e‘lytic Cu plating.
- Horizon®: (BondFilm, Stannatech) Oxide replacement, immersion tin.
- vPlate®: Vertical continuous copper plating – double sided electrochemical plating tool.
- Geode™: PCB laser drilling system – CO₂ via drilling for HDI PCB manufacturing and integrated circuit packaging
- Capstone™: Flex PCB laser drilling system – breakthrough productivity for flex PCB processing needs