Nichem® MP 1188
Mid phosphorus electroless nickel process
Pb and Cd-free
Fulfills all requirements of ELV, RoHS and WEEE
Designed to comply with extremely low bath loading
Deposit contains 5 – 8% P with an as deposited hardness of 550 – 650 HV0.1
- Pb and Cd- free (ELV and WEEE/RoHS compliant)
- Wide operation window
- Easy initiation at low surface area conditions
- Stable at high surface area conditions
- Excellent initiation on brass and copper
- Extraordinary high tolerance to zinc contamination
- Highly suited to multiple substrates
- Consistently high brightness
- Automotive applications
- Oil and gas industries
Nichem® MP 1188
High efficiency mid phosphorus for remarkable low bath loading
With Nichem® MP 1188, Atotech provides a fully bright and ELV, RoHS and WEEE compliant mid phosphorus plating process capable of standing up to the highest production demands, but also with the flexibility you need to accommodate a range of surface areas and multiple substrates – all in one process!
A Nichem® MP 1188 deposit contains 5 – 8% P with an as deposited hardness of 550 – 650 HV0.1. It provides consistent brightness over the whole bath life and is applicable for many different metal substrates. The deposit is completely free of Pb and Cd and fulfills all requirements of ELV, RoHS and WEEE.
What inspires us
Why we developed Nichem® MP 1188
The modern demands of an electroless nickel plating operation are high, and the applications range anywhere from high production automotive to lower volume job shop. Typically an electroless nickel process is specifically suited to an application. A new process should cover diverse demands and be suitable for a range of surface areas and multiple substrates.
Nichem® MP 1188 is a fully bright mid phosphorus plating process capable of standing up to the highest production demands. It also provides the flexibility needed to accommodate a range of surface areas and multiple substrate. For example, it has outstanding initiation on copper and brass. It also presents a high tolerance to zinc contamination thus allowing direct plating on zincated aluminum alloys throughout a prolonged bath life without sacrificing brightness or adhesion.