by Markus Lehr | May 16, 2018 | Tradeshows and events
Spherolyte® Cu UF3: Micro via filling post anneal Berlin, 17 May, 2018: Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth,...
by Markus Lehr | May 15, 2018 | Press releases
InPro® THF: Current density: 3.0 A/dm², dimple < 3μm [/et_pb_text][/et_pb_column][et_pb_column type="2_3"][et_pb_text admin_label="New products for advanced HDI and flex/ flex-rigid PCBs at C’Tex 2018" text_font_size="18" border_style="solid" _builder_version="3.2.2"]...
by Katharina Stier | May 14, 2018 | Tradeshows and events
Come and join us at the Corrosion and Engineering Conference in Peoria. Atotech will be presenting BluCr® and also our approach to fluid delivery connectors using zinc nickel and zinc flake technology. BluCr® is the first trivalent chromium hard chrome plating process...
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