Coverage performance comparison vs. Neoganth® B Pre Dip on 4 different base materials (Isola IS410, Panasonic R1755C, Nanya NP140, Shengyi S1141) after new make-up, throughput and with maximum drag-in of Neoganth® W Pre Dip into the subsequent activator bath Berlin,...
Atotech’s MultiPlate® for Power IC Berlin, 6 March, 2018: Atotech announced that it will present and exhibit at Semicon China 2018 to be held in Shanghai from March 14 to 16, 2018. On Friday, March 16, from 11:30 to 11:45 am, Cassandra Melvin, Global Product Manager...
Atotech adds Vice President HR position to the senior management team Daniel Wan will drive strategic HR initiatives and develop the HR function globally Berlin, 5 March, 2018: Atotech reinforces its strategic positioning in the HR organization by adding Daniel Wan as...
Atotech’s revolutionary new tool called MultiPlate® for FOPLP Berlin, 28 February, 2018: At the upcoming IMAPS Device Packaging Conference 2018 next week, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging...
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