by Eva Dannemann | Jul 5, 2017 | Press releases
Process flow for BondFilm® LDD MSAP + LDD MSAP Enhancer Berlin, 6 July, 2017: Atotech introduces BondFilm® LDD and BondFilm® LDD Enhancer, its latest additions to the BondFilm® product family, the worlds most successful, reliable and omnipresent oxide replacement... 
by Markus Lehr | Jun 1, 2017 | Press releases
High phosphorus electroless nickel process Berlin, May 2017, 2017: The electroless nickel plating process as used today was first developed more than 60 years ago and has since evolved to meet ever increasing industrial demands. As the name suggests, electroless... 
by Markus Lehr | Apr 12, 2017 | Press releases
Atotech to present its market leading chemistry and equipment solutions at the KPCA 2017 BERLIN, 12. April, 2017: Atotech, one of the leading companies for specialty plating chemicals, equipment and services will be showcasing its latest product developments at KPCA... 
by Markus Lehr | Mar 1, 2017 | Press releases
Atotech’s ST-Line®, Uniplate® PLBCu6 and Uniplate® PLB at CPCA 2017 BERLIN, 28. February, 2017: Atotech, the global leader in specialty plating chemicals, equipment and services today confirmed its participation at the upcoming CPCA show to be held in Shanghai, China,... 
by unitb2 | Feb 21, 2017 | Press releases
Atotech to sponsor ISS Europe 2017 Atotech is a proud sponsor of the SEMI Industry Strategy Symposium (ISS) Europe, which takes place from March 5 to 7 in Munich, Germany. As official sponsor of the “Lucky Draw,” an Atotech representative will have the pleasure of... 
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