by Xenia Karasev | Feb 1, 2019 | Press releases
Berlin, 1 February, 2019: Atotech has once again earned a Top Employer award in Germany, which is awarded annually by the Top Employers Institute. In conferring the award, the institute again acknowledged and confirmed Atotech’s continuous focus of its people strategy... 
by Xenia Karasev | Jan 22, 2019 | Press releases
Printoganth® T1: Horizontal high throw electroless copper for amSAP technology Berlin, 23 January, 2019: Atotech is one of the world’s leading suppliers of specialty chemicals and equipment for the printed circuit board, package substrate and semiconductor industry.... 
by Xenia Karasev | Jan 15, 2019 | Press releases
MultiPlate® Panel – Next generation plating system and Innolyte process family for panel level packaging NovaBond® EX – Build-up dielectrics and solder resist materials: Excellent and stable performance after thermal stress for a wide range of ABF... 
by Markus Lehr | Nov 22, 2018 | Press releases
SEM micrographs of copper structure after annealing (125°C, 4h) deposited at 3 ASD with the novel chemistry Atotech, one of the leading companies worldwide in providing specialty chemicals and equipment for the printed circuit board, IC-substrate and semiconductor... 
by Markus Lehr | Nov 9, 2018 | Press releases
Plating fine lines, Cu pads Atotech Group, a leading chemical and equipment supplier for PCB, semiconductor advanced packaging and dual damascene applications, will exhibit and present its latest products for power, automotive, and mobile semiconductor applications at... 
by Markus Lehr | Oct 22, 2018 | Press releases
Showing Atotech’s Inpulse® 2THF process performing “X-plating and BMV filling” to realize a uniform bridge plating and through hole filling – a patented plating technology by Atotech Atotech, a leading provider of chemicals and equipment for PCB, package... 
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