At booth EF 51 Atotech® product experts will be introducing the combination of wet chemical processes, production equipment (plating lines, lasers, auxiliaries) and software solutions. A spotlight is set on the various solutions available for e-mobility e.g. BEV, HEV and PHEV batteries and other components. This year highlights include:
V-Plate®: Vertical continuous Cu plating technology of choice for advanced HDI & IC substrate
GeodeTM: High-precision CO2 via drilling for HDI PCB manufacturing and IC packaging
CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
CupraEtch® DF 8000: Low etch rate and etch depth dry film pretreatment
Noviganth® AF 76: High build self-accelerating electroless copper
OS Tech® SIT 2: The OSP solution combinable with ENIG
Stannopure® PF 10: High-speed green tin process for lead frames and connectors
InPro® MVF 2: Next-generation blind micro via filling in VCP for HDI production
Event: IPCA 2023
Date: September 13-15, 2023
Venue: Bangalore International Exhibition Centre (BIEC)
Booth: EF 51
For more information on IPCA please visit: Activities | IPCA (ipcapcb.org)