Berlin, September 7, 2021 – Berlin, September 7, 2021 – Atotech, a global supplier of specialty chemicals, equipment, software, and services announced its presence during the ongoing 20th INTERFINISH World Congress from September 6 to 8. Under the guidance of the International Union of Surface Finishing (IUSF), this year’s conference has been organized as an online digital event.

As part of the conference program, Atotech has been invited to present the following:

Presentation schedule:

Presentation title Date Time (JST) Speaker
BluCr® Trivalent Hard Chrome Process 6-Sep-21 17:00-17:20 Josep Sans
Fumalock® – The non-PFAS, non-PFOS fume suppressant for chrome plating 6-Sep-21 17:40-18:00 Josep Sans
Nichem® HP 1170 – Superior corrosion resistant high P EN process 6-Sep-21 17:40-18:00 Shakeel Akhtar
Hexavalent chromium free pretreatment for plastics – Covertron® 6-Sep-21 16:40-17:00 Ernesto Salazar
Cupracid® PV – Solar cell metallization by low-stress and ductile copper plating 6-Sep-21 16:00-16:20 Torsten Voss
Metallization of additive manufactured polymer parts in decorative and functional applications 6-Sep-21 14:50-15:10 Michael Merschky
High end corrosion protection with zinc‐iron alloy: Hiron® 6-Sep-21 16:20-16:40 Mike Krüger
Zintek® ONE HP: One zinc flake layer – Great corrosion protection 6-Sep-21 15:10-15:30 Markus Ahr
Near neutral pH weld descaling – Improving quality with sustainable chemical solutions 7-Sep-21 8:30-8:50 Brandon Lloyd
Carbon Footprint Reduction 7-Sep-21 8:10-8:30 Brandon Lloyd
A new era of In-house chemical paint removal – the ideal choice for hook and rack cleaning 6-Sep-21 15:30-15:50 Sylvain Masson
DynaSmart® ‐ innovative compact modular plating line for high productivity and greater flexibility with a smaller environmental footprint 6-Sep-21 17:20-17:40 Steffen Seuss
Introduction of a Novel Palladium Free Activator for Electroless Copper Processing 6-Sep-21 16:40-17:00 Roger Massey
Layer Characteristics of Electroless Palladium and Autocatalytic Gold and its impacting factors 6-Sep-21 17:00-17:20 Britta Schafsteller
Novel adhesion enhancement system for high-speed substrates manufacturing 6-Sep-21 16:00-16:20 Toshio Honda
Advanced adhesion promotion system for metallization of copper on glass substrate. 6-Sep-21 15:30-15:50 Toshio Honda
A Non-Etched Non-Roughened Adhesion Promoter for PPF (Pre-Plated Lead frames) 8-Sep-21 10:00-10:20 Din-Ghee Neoh
Challenges and solutions in electroless under bump metallization (UBM) -The final finish for highest reliability in wire bonding and soldering applications 6-Sep-21 17:20-17:40 Stefan Pieper

All our presentations will also be available as recordings for all conference registrants.

Conference: INTERFINISH 2021 – 20th world congress

Date: September 6 – 8, 2021

For more information, please visit: