Berlin, September 7, 2021 – Berlin, September 7, 2021 – Atotech, a global supplier of specialty chemicals, equipment, software, and services announced its presence during the ongoing 20th INTERFINISH World Congress from September 6 to 8. Under the guidance of the International Union of Surface Finishing (IUSF), this year’s conference has been organized as an online digital event.
As part of the conference program, Atotech has been invited to present the following:
Presentation schedule:
| Presentation title | Date | Time (JST) | Speaker |
| BluCr® Trivalent Hard Chrome Process | 6-Sep-21 | 17:00-17:20 | Josep Sans |
| Fumalock® – The non-PFAS, non-PFOS fume suppressant for chrome plating | 6-Sep-21 | 17:40-18:00 | Josep Sans |
| Nichem® HP 1170 – Superior corrosion resistant high P EN process | 6-Sep-21 | 17:40-18:00 | Shakeel Akhtar |
| Hexavalent chromium free pretreatment for plastics – Covertron® | 6-Sep-21 | 16:40-17:00 | Ernesto Salazar |
| Cupracid® PV – Solar cell metallization by low-stress and ductile copper plating | 6-Sep-21 | 16:00-16:20 | Torsten Voss |
| Metallization of additive manufactured polymer parts in decorative and functional applications | 6-Sep-21 | 14:50-15:10 | Michael Merschky |
| High end corrosion protection with zinc‐iron alloy: Hiron® | 6-Sep-21 | 16:20-16:40 | Mike Krüger |
| Zintek® ONE HP: One zinc flake layer – Great corrosion protection | 6-Sep-21 | 15:10-15:30 | Markus Ahr |
| Near neutral pH weld descaling – Improving quality with sustainable chemical solutions | 7-Sep-21 | 8:30-8:50 | Brandon Lloyd |
| Carbon Footprint Reduction | 7-Sep-21 | 8:10-8:30 | Brandon Lloyd |
| A new era of In-house chemical paint removal – the ideal choice for hook and rack cleaning | 6-Sep-21 | 15:30-15:50 | Sylvain Masson |
| DynaSmart® ‐ innovative compact modular plating line for high productivity and greater flexibility with a smaller environmental footprint | 6-Sep-21 | 17:20-17:40 | Steffen Seuss |
| Introduction of a Novel Palladium Free Activator for Electroless Copper Processing | 6-Sep-21 | 16:40-17:00 | Roger Massey |
| Layer Characteristics of Electroless Palladium and Autocatalytic Gold and its impacting factors | 6-Sep-21 | 17:00-17:20 | Britta Schafsteller |
| Novel adhesion enhancement system for high-speed substrates manufacturing | 6-Sep-21 | 16:00-16:20 | Toshio Honda |
| Advanced adhesion promotion system for metallization of copper on glass substrate. | 6-Sep-21 | 15:30-15:50 | Toshio Honda |
| A Non-Etched Non-Roughened Adhesion Promoter for PPF (Pre-Plated Lead frames) | 8-Sep-21 | 10:00-10:20 | Din-Ghee Neoh |
| Challenges and solutions in electroless under bump metallization (UBM) -The final finish for highest reliability in wire bonding and soldering applications | 6-Sep-21 | 17:20-17:40 | Stefan Pieper |
All our presentations will also be available as recordings for all conference registrants.
Conference: INTERFINISH 2021 – 20th world congress
Date: September 6 – 8, 2021
For more information, please visit: https://spp.material.nagoya-u.ac.jp/wp/interfinish2020