News
Press releases
Atotech wins distinction as a Top Employer 2019 in Germany
Corporate
Atotech has once again earned a Top Employer award in Germany, which is awarded annually by the Top Employers Institute. In conferring the award, the institute again acknowledged and confirmed Atotech’s continuous focus of its people strategy.
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Atotech to present a series of new processes at the IPC APEX Expo 2019
Electronics
Atotech to present a new high-throw e’less Cu bath, through-hole, BMV filling, and conformal plating electrolyte, and its revolutionary ENIG final finish at the IPC APEX Expo 2019.
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A new series of panel level plating processes and equipment for high resolution pattern plating
Electronics
Atotech to present its new series of panel level plating processes and equipment for high resolution pattern plating during NEPCON Japan 2019.
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Atotech at the Electronics Packaging Technology Conference 2018
Electronics
Atotech will introduce a new SAP copper electrolyte which allows for higher current densities while still keeping very good copper thickness within unit distribution (WUD) results.
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Atotech to present at SEMICON Europa and electronica 2018
Electronics
Atotech’s product experts will be present at booth 569 in Hall A4 to discuss latest technology, trends, and future requirements.
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Atotech to exhibit and present at TPCA Show and IMPACT Conference 2018
Electronics
Atotech will present “Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook”.
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Atotech’s Surface Finish specialist Rick Nichols at this year’s SMTA International 2018
Electronics
Atotech invites all conference visitors to join the talks and meet Rick Nichols to discuss these and other current product highlights.
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Reducing manufacturing costs on Fan-Out Panel-Level Packaging (FO-PLP)
Electronics
Atotech specialists will speak at the iMAPS on several current topics such as recent developments and solutions for Panel-Level Packaging.
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The next revolution in electroless copper for advanced FPCB
Electronics
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating.
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Products for a SMART world – Atotech to present and exhibit at the 38th IEMT conference
Electronics
Atotech today announced that it will participate in the 38th International Electronics Manufacturing Technology (IEMT) Conference 2018.
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