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Atotech at the ECTC conference in Las Vegas 2019


Atotech will showcase its latest metallization products including the Spherolyte® product line for next generation RDL and pillar, the Xenolyte® product line for all electroless metallization needs, as well as its new MultiPlate® electrolytic deposition platform, designed as a flexible solution for both wafer and panel plating.

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Susanne Richter
Phone: +49 30-34 98 54 18

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