News & press

Berlin, November 2 – MKS’ Atotech will be exhibiting at Semicon Europa and present its latest results on Cu-to-Cu direct bonding for 3D integration during Advanced Packaging Solutions Conference (APC) in Munich on November 16 from 11:50 a.m. – 12:10 p.m. (room 14c;...

Berlin, Germany – October 17, 2022 Atotech, MKS Instruments’ globally leading brand in surface-finishing solutions, will participate at this year’s Taiwan Circuit Industry International Exhibition (TPCA Show) and International Microsystems, Packaging, Assembly and...

Berlin, Germany – October 11, 2022 Atotech, a brand within the Materials Solutions Division of MKS Instruments, developing leading process and manufacturing technologies for next-generation power semiconductors and advanced packaging, joins the International...