Advanced wet chemical processes, production equipment, and service
We develop, produce and sell plating chemicals and equipment for manufacturing printed circuit boards, package substrates, semiconductors, leadframes and connectors and are recognized as the leading innovator within the electronics plating industry.
The trends towards better connectivity, greater device functionality, performance, and miniaturization, are leading to higher complexity in our customers’ products, which require advanced technology solutions more than ever before.
Today we serve global manufacturers with leading horizontal equipment and wet chemical process technology in the areas of surface treatment, metallization, electrolytic plating, final finishes, as well as pad metallization, copper pillar, RDL, TSV, and dual damascene plating. Our comprehensive portfolio, consisting of horizontal and vertical processes, allows us to participate in various future growth areas, such as next-generation smartphones, electrical and autonomous vehicles, the Internet of things, 5G, virtual reality, and artificial intelligence.
Portfolio overview
At home in major industries
Our solutions make innovation possible in a wide spectrum of industries
From advanced mobile devices, computers and consumer electronics, through communication infrastructure, automotive and aerospace to medical and industrial – our advanced technology solutions support the clever functionalities inherent in all kinds of electronics components and devices. This not only indicates the scope of our technologies but also the broad mix of products we offer and industries we serve.
Globally, leading manufacturers in the fields of printed circuit boards, package substrates, semiconductors, leadframes, and connectors rely on our expertise, products, service and innovation. We collaborate directly with our customers, OEMs and Tier 1 suppliers, which gives us strategic insights into market and technology trends and future product requirements. This strengthens our ability to invest in the right direction to meet the growing demand – even faster.
Smartphone
Big data infrastructure
Automotive electronics
Consumer electronics
Communication infrastructure
Computing
Mobile device solutions
Our chemical process technologies and equipment are used to build the most complex and challenging printed circuit boards (flex-/-rigid flex, multilayer, HDI using mSAP technology), package substrates, semiconductors, leadframes, and connectors used in advanced mobile devices today.
Read moreAutomotive solutions
We pay special attention to the needs and demands of automotive manufacturers and their suppliers. Our product range offers wet chemical process technology and equipment that is used to manufacture printed circuit boards (flex-/-rigid flex, multilayer, HDI), package substrates, semiconductors, leadframes, and connectors used for engine and body control units, power train, mechatronics, lighting, info- and entertainment, sensors, radar, cameras, and ADAS modules.
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Our technical and service centers
Helping customers stay one step ahead in all key markets
With our global TechCenter network, customer support is always close by. Our expert teams provide first-class support and consultation for every technical requirement.
We run 10 TechCenters in the Electronics business unit. They are in Germany, Japan, China, Singapore, Taiwan, South Korea, India and the USA.
Optimize the interconnect℠
Atotech plating equipment and process chemistries combined with ESI laser drilling systems
MKS combines Atotech’s systems technology and chemical processing expertise with ESI’s via drilling expertise, forging two pioneers in PCB solutions. This synergy drives the development of adjacent PCB processing technologies and pushes the boundaries of the interconnect. This industry leading approach is creating solutions for complex PCB and Package Substrate manufacturing, satisfying current requirements as well as those needed for future roadmaps.
Uniplate® PLB
Our new innovative plating tool
Uniplate® PLB systems solution is designed for advanced substrates, minimized consumption of energy, water and chemistry and is optimized for a high level of automation, repetitive high-quality production results, as well as the next phase of industrial internet of things (IIOT) and Smart Factory production.
Featured products
ViaKing®
Our enhanced graphite based direct metallization process
Silvertech® C
Highest wear off performance for a longer life time
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