vPlate®
VCP systems approach for advanced HDI and IC substrates, suitable for mSAP, amSAP and SAP technology.
Best uniformity
<10% applying insoluble anodes, adjustable shielding and optimised jigs
Highest flexibility
regarding customer requirements on line size, throughput, copper thickness and panel dimensions
Chemistry and tool
out of one hand provide customers with a true advantage in the production process for optimal performance
vPlate is our vertical continuous copper plating equipment for advanced pattern plating.
vPlate was developed to outperform existing plating lines available in the market today. Our new plating tool does that already by providing uniformities of ± 7% and touch-free thin panel transportation down to 36 μm + 2 × 2 μm Cu clad. It achieves this by utilizing insoluble anodes with adjustable anode and cathode shielding. In addition, the tool fulfills technology roadmaps for next-generation HDI and package substrates down to L/S 8/8.
The new system is fully automated and therefore automatic loading/unloading, copper replenishment, panel size adaption and RFID recognition come as standard features with our new vPlate system. It could be further upgraded by automatic grease supply and jig monitoring. We also put a lot of effort in making our new system as operator friendly as possible, as well as provide utmost customer flexibility in regards to line length or width requirements, therefore throughput, copper thickness and panel dimensions.
vPlate is designed to be best plating solution for adanced HDI and IC substrate, but can be utilised for various applications:
- Multilayer PCBs
- HDI PCBs
- Advanced HDI PCBs
- Rigid-flex PCBs
- IC substrates
In combination with our chemical processes, vPlate achieves outstanding performance for IC stubstrates and advanced HDI.
vPlate is our vertical electrolytic plating solution designed for touch‑free manufacturing environments, featuring:
- Thin panel transport capability down to 36µm + 2×2 Cu clad.
- User-focused HMI and control system for full process control.
- Operator-friendly due to fully automatic handling, including automatic copper and chemistry replenishment.
- IIoT-ready with connection capability to customers’ MES systems.
- Operator-friendly due to full automatic handling, incl. automatic copper & chemistry replenishment.
- Utmost energy and water efficiency by using specialized motors and latest cascade rinsing technology.
- Flexible line layout that can be adjusted to customers’ space availability and technical specifications.
- Insoluble anodes combined with adjustable anode and cathode shielding.
- Ultimate energy and water efficiency through the use of specialised motors and the latest cascade rinsing technology.
- Systems approach offering a complete production solution consisting of equipment, chemical processes, spare parts and maintenance services.
VCP Atotech systems approach
What inspires us
Why did we develop vPlate
Your challenge
To keep up with stricter technical requirements for pattern plating applications and especially the plating of smaller dimensions at reasonable cost.
Our solution
vPlate is our new advanced, high throughput, cost-efficient system for vertical touchless copper deposition.