vPlate®
VCP systems approach for advanced HDI and IC substrates, suitable for mSAP, amSAP and SAP technology.
Best uniformity
<10% applying insoluble anodes, adjustable shielding and optimised jigs
Highest flexibility
regarding customer requirements on line size, throughput, copper thickness and panel dimensions
Chemistry and tool
out of one hand provide customers with a true advantage in the production process for optimal performance
vPlate is our vertical continuous copper plating equipment for advanced pattern plating.
vPlate® was developed to outperform existing plating lines available in the market today. Our new plating tool does that already by providing uniformities of ± 7% and touch-free thin panel transportation down to 36 μm + 2 × 2 μm Cu clad. It achieves this by utilizing insoluble anodes with adjustable anode and cathode shielding. In addition, the tool fulfills technology roadmaps for next-generation HDI and package substrates down to L/S 8/8.
The new system is fully automated and therefore automatic loading/unloading, copper replenishment, panel size adaption and RFID recognition come as standard features with our new vPlate® system. It could be further upgraded by automatic grease supply and jig monitoring. We also put a lot of effort in making our new system as operator friendly as possible, as well as provide utmost customer flexibility in regards to line length or width requirements, therefore throughput, copper thickness and panel dimensions. The line layout can vary from one process to process track with each track up to 14 plating cells (app 34m plating length).
vPlate® can be used for processing various PCB types, ranging from standard multilayer to advanced HDI, Rigid-Flex and IC substrates:
- Multilayer PCBs
- HDI PCBs
- Advanced HDI PCBs
- Rigid-flex PCBs
- IC substrates
Vertical continuous Cu plating technology of choice for advanced HDI & IC substrate.
With vPlate® we add to our industry unique systems approach by offering a perfectly harmonized and full production solution that consists of the chemical process and the production equipment.
The systems features and benefits are:
- Advanced plating capabilities through insoluble and segmented anodes
- Best uniformity by adjustable anode and cathode shielding
- Thin panel transport capability down to down to 36µm + 2×2 Cu clad
- Flexibility regarding the line layout – adjustable to customer’s space availability and technical specifications
- Operator-friendly due to full automatic handling, incl. automatic copper & chemistry replenishment
- Utmost energy and water efficiency by using specialized motors and latest cascade rinsing technology
VCP Atotech systems approach
What inspires us
Why did we develop vPlate®
Your challenge
To keep up with stricter technical requirements for pattern plating applications and especially the plating of smaller dimensions at reasonable cost.
Our solution
vPlate® our new advanced, high throughput, cost-efficient system for vertical touchless copper deposition.