Our unique systems approach
Inline processing for printed circuit boards (HDI/MLB and Flex/Flex-Rigid Boards), package substrates, and semiconductor applications
Quick facts
- Unique systems approach: Supplying chemistry, equipment, process know-how, service and spare parts
- Leading sustainable solutions
- Two production sites in Germany and China
- Clean room production capabilities in Germany
Applications
- Printed circuit boards (HDI, MLB, Flex / Flex rigid boards)
- IC substrates
- Semiconductor
- Advanced packaging
- Flat panel displays
Product portfolio
Permanganate desmear
Atotech versatile desmear equipment Uniplate® P allows high throughput rates, from multilayers to thicker boards and HDI boards or bare laminate boards for semi additive processes, giving the best results with almost all available base material (except chemical non-resistant substrates and materials containing acrylic adhesives). More than 380 Uniplate® P lines have been installed for high volume production of MLBs, HDIs and IC substrates for high-end applications such as mSAP/amSAP. It provides the leading transportation capability for thinnest PBS boards going down to 25µm + 2×2µm Cu clad.
Our Uniplate® P has a long successful tradition. Based on this Atotech has developed the next generation „New Uniplate“ design which is incorporating all the benefits and advantages of our traditional Uniplate® PLB platform. On top of this, the „New Uniplate“ features advances and benefits in reduced footprint, enhanced maintenance and user friendliness, energy consumption reductions, new pump technology and sustainable process control. Following the technology requirements, we improved the fine line capability by adding many sophisticated solutions for particle avoidance and particle reduction.
Equipment highlights:
- High quality stainless steel sweller and permanganate modules ensure maximum process stability and low maintenance.
- Integrated stainless steel filtration system for sweller and permanganate.
- Designed to save resources – highly efficient chemical regeneration system for continuous production at stable process parameters (patented Oxamat® for permanganate regeneration) and sophisticated rinse concept.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- Strong process performance with with patented flood bar technology.
The Polygon P line is Atotech new desmear equipment for printed circuit board manufacturers with high reliability and high performance demands in multilayer, rigid-flex and HDI panel processing. The new horizontal line is available in line speeds up to 3.5m/min with to different transportation systems for 24“ and 28,5“. Polygon Line series features all production-critical characteristics and applies them to a highly reliable, high-volume, and cost-effective machine.
Equipment highlights:
- Equipped with technology to reduce consumption of water and chemistry (e.g. patented Oxamat for permanganate regeneration, encapsulated modules, minimal bath volumes, multi-stage cascade rinses and condenser units).
- Strong desmear performance with ultra sonic devices for sweller and permanganate.
- The line is available with steam or hot water heating to use existing heat sources at customer site and save electrical energy consumption.
- Strong process performance with patented flood bar technology.
Electroless copper process
The leading horizontal electroless copper plating line, the Uniplate® LB, is the world standard for classical horizontal through-hole metallization. Systems solutions are available for a huge variety of board thicknesses and sizes. More than 330 Uniplate® LB lines have been installed for high volume production of MLBs, HDIs and IC substrates for high-end applications such as mSAP/amSAP. It provides the leading transportation capability for thinnest PBS boards going down to 25µm + 2×2µm Cu clad.
Our Uniplate® LB has a long successful tradition. Based on this Atotech has developed the next generation „New Uniplate“ design which is incorporating all the benefits and advantages of our traditional Uniplate® PLB platform. On top of this, the „New Uniplate“ features advances and benefits in reduced footprint, enhanced maintenance and user friendliness, energy consumption reductions, new pump technology and sustainable process control. Following the technology requirements, we improved the fine line capability by adding many sophisticated solutions for particle avoidance and particle reduction.
Equipment highlights:
- Superior through hole metallization with patented floodbar technology.
- Highly efficient pump circuits for effective fluid control and efficient energy consumption.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- Chemistry analyzing system for optimum performance at specific process steps.
The Polygon LB line is Atotech new electroless copper equipment for printed circuit board manufacturers with high reliability and high performance demands in multilayer, rigid-flex and HDI panel processing. The new horizontal line is available in line speeds up to 3.5m/min with to different transportation systems for 24“ and 28,5“. Polygon Line series features all production-critical characteristics and applies them to a highly reliable, high-volume, and cost-effective machine.
Equipment highlights:
- State-of-the-art throwing power in THs and BMVs due to Atotech patented floodbar technology.
- Automated cup dosing system enables a reliable and maintenance friendly solution.
- The line is available with steam or hot water heating to use existing heat sources at customer site and save electrical energy consumption.
- Semi automatic cleaning with best coverage and reliable cleaning performance.
Direct plating
Uniplate® NP is designed for the Neopact direct plating process and is suitable for all base materials including Teflon.
The Uniplate® CP is the horizontal conveyorized production system to go with Atotech Ecopact conductive polymer direct plating process for HDI, MLB and flex/ flex-rigid productions. This line is compatible with a wide range of base materials.
Equipment highlights:
- Selective process, capable of BMV and direct pattern plating.
- Superior through hole metallization with patented floodbar technology.
- Highly efficient pump circuits for effective fluid control and efficient energy consumption.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- Low space requirement.
Horizontal electrolytic copper process
More than 930 platers have been purchased from MKS Atotech since its release in 1987. Steadily improved from DC to InPulse1 to now Uniplate® Cu InPulse2 (Ip2), our horizontal plating equipment is the cutting edge technology for producing high-end mass products in various applications, such as through hole filling (THF), filling of blind micro vias, and conformal plating.
Equipment highlights:
- Pulse rectifiers for even current distribution and Frequency controlled high current density guaranteeing improved surface quality and uniformity.
- Insoluble anodes for improved geometry.
- Inline filtration for particle reduction.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
Vertical electrolytic copper process
Our new plating solution V-Plate® provides customers with best results using advanced manufacturing technologies such as mSAP or SAP and can be applied to various PCB types, ranging from standard multilayer and HDI to advanced HDI, rigid-flex and IC substrates. Uniformities of ±10% can be realized leveraging our concept for insoluble segmented anodes with adjustable anode and cathode shielding. Through touch-free transportation of thin panels (down to 36µm + 2×2 Cu clad), we today fulfill all market requirements for vertical continuous copper plating.
Equipment highlights:
- Advanced plating capabilities through insoluble and segmented anodes.
- Best uniformity by adjustable anode and cathode shielding.
- Thin panel transport capability down to down to 36µm + 2×2 Cu clad.
- Flexibility regarding the line layout – adjustable to customer’s space availability and technical specifications.
- Operator-friendly due to full automatic handling, incl. automatic copper & chemistry replenishment.
- Utmost energy and water efficiency by using specialized motors and latest cascade rinsing technology.
Surface treatment / Innerlayer bonding
The Atotech Horizon® Bondfilm ® family is an integrated production solution for bonding enhancement and surface treatment. It consist of Horizon® Bondfilm ® – our intelligent and cost effective solution for improved inner layer bonding and Horizon® Bondfilm ®LDD – a unique process to improve CO2 laser absorption of surfaces prior to laser direct drilling applications at maximum reliability.
It offers Atotech latest technology package in chemical processing, thin material conveyance and advanced fluid delivery.
Equipment highlights:
- Automatic discharging devices.
- Advanced cascade-rinsing technology with highly efficient and optimized pump circuits.
- Fully automated panel tracking control.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- Available with analyzer monitoring technology and fully automatic control of dosing system.
- Strong process performance with patented flood bar technology.
Our new generation Polygon ST Line ® is an innovative horizontal system designed for the latest requirements on solder mask and dry film treatment during the production of printed circuit boards. Our new equipment is optimized for high volume manufacturing, provides maximum yield and best-in-class uniformity over the panel. All in all a great new portfolio addition that is fully compatible with our CupraEtch® process chemistry series and in combination provides a state-of-the-art solutions-based package that combines chemistry, equipment, software and service.
Equipment highlights:
- High volume production system up to 4.0m/min line speed and 24,8“ wide PCBs.
- Advanced Ccascade-rinsing technology with highly efficient and optimized pump circuits.
- Spray bar oscillation with easy adjustment and control function for optimized etching uniformity of more than 90%.
- Effective drying performance with multi-zone dryer configuration.
- Atotech high flow filter system for fine L/S production.
- Precise control of dosing parameters via panel tracking and cup dosing system.
Final finishing
The Stannatech® state-of-the-art tin deposition technology sets the world standard in thinnest tin deposition on printed circuit boards, making it one of the few surface finishing systems verified by all major automobile manufacturers. With our unique Crystallizer™ and ConStannic™ control, the system is perfect for immersion tin for multiple Pb-free soldering and press-fit technology. Stannatech® achieves the highest mileages and process reliability in the market.
Equipment highlights:
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- ConStannic™ and Crystallizer™ auxiliary equipment result in extended life time and efficiency of the applied chemistry – no feed and bleed process
- The line is available with hot water heating system.
- Leading transportation system enable parallel transportation of smaller panel pieces.
- Strong process performance with patented flood bar technology.
Electrolytic plating for the semiconductor and advanced packaging industry
MultiPlate® is an innovative ECD plating system designed to tackle the current and future challenges for optimal performance in advanced packaging applications.
Its key technology is the simultaneous front and backside plating capability with optional individual process control for each substrate side, including current density, fluid flow, and pulse plating parameter enabling superior surface distribution at high plating speed.
For advanced packaging applications MultiPlate® is available for round and square substrates for wafer and panel-level packaging applications.
Electroless metallization for displays
With decades of experience in horizontal wet-chemical electroless copper systems, MKS Atotech has developed the new high-speed electroless copper system consisting of CupraTech® FPD process and VisioPlate®. It is tailored to the requirements of the next generation products of the flat panel display industry.
The VisioPlate® tool features:
- Reliable transport of large and thin glass substrates up to gen8 size.
- Adjustable line speed for an electroless copper layer of up to 2µm.
- Special features for particle prevention.
Service and spare parts
With over 1,200 production lines running globally today, we have brought our spare part and service offering to perfection. Today, we offer original parts for every crucial component of our equipment product lines, for Uniplate®, Horizon®, MultiPlate®, VisioPlate®, as well as for our latest portfolio additions Polygon® and vPlate®.
Customer benefits:
- Atotech original spare parts meet the highest quality and reliability requirements for best process performance.
- Ensure maximum equipment availability.
- Systems offering consisting of equipment, process chemicals and service (installation, production support, inspection and spare parts).
- Competitive cost of ownership.
- Extended lifetime of your Atotech equipment.
- Global availability of Atotech original spare parts.
- Globally available service teams to support on-site installations.
- Excellent trained and experienced service team.
Featured products

MultiPlate®
Innovative electrochemical plating system for next generation packaging

Polygon PLB line®
New cost-effective plating tool for highly reliable, high-volume PCB production
Uniplate® PLB
Our new innovative plating tool
Uniplate® PLB systems solution is designed for advanced substrates, minimized consumption of energy, water and chemistry and is optimized for a high level of automation, repetitive high-quality production results, as well as the next phase of industrial internet of things (IIOT) and Smart Factory production.

Transportation technology
Universal transport system (UTS) – For ultra flex material processing (UTS-xs)
Atotech universal transport system is designed to enable our desmear, PTH and copper plating equipment to process a broad range of different panel thicknesses. The universal transport system consists of UTS-XL, UTS-s, UTS-xs and the new UTS-xs+. It is the latest addition to the UTS that opens new possibilities for safe thin material transportation in our Uniplate® P and LB lines.